Multilayer Microchannel Heat Transfer Device
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Solution Overview
Problem
Existing manufacturing processes for microchannel heat transfer devices, such as oscillating heat pipes, are costly and inefficient for producing deep-narrow channels with high aspect ratios, which are essential for high heat flux applications.
Innovation Solution
A multilayer microchannel heat transfer device is fabricated by stacking and bonding multiple layers with shallow microchannels and/or slots, forming deep narrow composite microchannels with high aspect ratios, using a low-cost manufacturing approach.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If CNC milling is used to manufacture deep-narrow channels, then manufacturing precision is improved, but manufacturing cost increases
Solution Approach 1:
The device is divided into multiple separate layers (first outer layer, second outer layer, and at least one interstitial layer), each containing shallow microchannels. These layers are stacked and bonded together to form deep composite microchannels. This segmentation allows each layer to be manufactured independently using low-cost processes like wet-etching, while the stacked configuration achieves the required deep channel depth without requiring expensive deep-milling operations.
Solution Approach 2:
The invention transitions from creating deep channels in a single layer (one-dimensional depth problem) to stacking multiple shallow channels from different layers (adding the layer dimension). By forming channels in separate layers and stacking them, the effective channel depth is achieved through dimensional composition rather than single-step deep machining, enabling cost-effective manufacturing.
2Productivity
If channel width is reduced to increase number of channels, then heat transfer efficiency is improved, but manufacturing difficulty increases
Solution Approach 1:
By dividing the device into multiple layers, each containing a subset of channels, the manufacturing complexity of individual narrow channels is reduced. Each layer can be etched with standard width channels using wet-etching processes, and the stacking arrangement achieves the high channel density required for heat transfer efficiency without requiring ultra-precise narrow channel fabrication in a single layer.
3Length of stationary object
If deep channels are manufactured in single layer, then channel depth is achieved, but manufacturing cost and complexity increase
Solution Approach 1:
The deep channel structure is segmented across multiple layers, with each layer contributing a portion of the total depth. This allows shallow channels to be manufactured in each layer using simple, low-cost processes, and the overall depth is achieved through the stacked configuration of multiple layers rather than single-step deep machining.
Solution Approach 2:
The channel depth problem is solved by adding the layer stacking dimension. Instead of creating the full depth in one layer through complex deep-etching or milling, the depth is achieved by stacking multiple shallow channels from different layers, converting a difficult single-step deep machining problem into a series of simple shallow channel fabrications followed by bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the cost-effective production of microchannel devices with high aspect ratio channels, enhancing their heat transfer efficiency and structural integrity while maintaining hermeticity.
Implementation Method 1
The first outer layer, the second outer layer, and the at least one interstitial layer are stacked and bonded together
Data Source
Figure 1A
Figure 1B
Figure 2A~2B
AI summary
A multilayer microchannel heat transfer device comprising a body having a first outer layer comprising at least one micro-sized first elongated recess, a second outer layer comprising at least one micro-sized second elongated recess, and at least one interstitial layer comprising at least one micro-sized elongated interstitial slot. The first outer layer, the second outer layer, and the interstitial layer(s) are stacked and bonded together having the interstitial layer(s) disposed between the first and second outer layer, whereby the first elongated recess(es), the second elongated recess(es) and the elongated interstitial slot(s) are aligned and combine to form at least one deep narrow composite microchannel having a high height to width aspect ratio internally disposed and enclosed within a resulting multilayer body.