Multilayer Millimeter-Wave Patch Antennas With Low Mutual Coupling
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Solution Overview
Problem
Electronic devices face challenges in supporting millimeter and centimeter wave communications due to substantial attenuation and distortion of signals, as well as susceptibility to mutual coupling among antennas.
Innovation Solution
The implementation of phased antenna arrays with diagonally-oriented feed terminals and multi-layer parasitic elements, including a rectangular patch element and overlapping parasitic patches, minimizes mutual coupling and enhances signal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If millimeter wave communications are implemented, then high bandwidth is achieved, but signal attenuation and distortion increase
Solution Approach 1:
The patent implements a nested multilayer antenna structure where multiple antenna elements are stacked vertically in close proximity. The first antenna element is positioned at a first height above the ground plane, the second antenna element at a second height, creating a nested configuration that enables MIMO operations while maintaining compact form factor and reducing signal attenuation through optimized spatial arrangement
Solution Approach 2:
The patent transitions from planar antenna arrangements to a three-dimensional multilayer configuration by positioning antenna elements at different heights above the ground plane. This vertical dimensionality change allows for better signal propagation characteristics and reduced mutual coupling while supporting high bandwidth millimeter wave communications
2Ease of manufacture
If traditional antenna configurations are used, then manufacturing is simpler, but mutual coupling between antennas increases
Solution Approach 1:
The patent employs a nested multilayer antenna structure where antenna elements are vertically stacked with optimized spacing. The first antenna element is positioned at a first height above the ground plane and the second antenna element at a second height, creating a nested configuration that reduces mutual coupling through increased vertical separation while maintaining manufacturing feasibility through standardized PCB layering techniques
Solution Approach 2:
The patent segments the antenna system into multiple independent antenna elements positioned at different heights and orientations. Each antenna element can be manufactured separately on different PCB layers and then assembled, allowing for optimized positioning to minimize mutual coupling while maintaining ease of manufacture through modular construction
Data Source
AI summary
An electronic device may have a phased antenna array. An antenna in the array may include a rectangular patch element with diagonal axes. The antenna may have first and second antenna feeds coupled to the patch element along the diagonal axes. The antenna may be rotated at a forty-five degree angle relative to other antennas in the array. The antenna may have one or two layers of parasitic elements overlapping the patch element. For example, the antenna may have a layer of coplanar parasitic patches separated by a gap. The antenna may also have an additional parasitic patch that is located farther from the patch element than the layer of coplanar parasitic patches. The additional parasitic patch may overlap the patch element and the gap in the coplanar parasitic patches. The antenna may exhibit a relatively small footprint and minimal mutual coupling with other antennas in the array.