Multilayer Moisture Barrier with ALD Interfacial Layer
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Solution Overview
Problem
Existing moisture barriers for semiconductor devices fail to maintain effective adhesion and moisture resistance over long-term exposure to heat and moisture, particularly in harsh outdoor environments, leading to delamination and loss of protective properties.
Innovation Solution
A multi-layer moisture barrier comprising a polymer layer, an interfacial layer formed by atomic layer deposition (ALD), and a barrier layer deposited by plasma enhanced chemical vapor deposition (PECVD), which provides robust adhesion and resistance to water and water vapor transmission, even under damp heat conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a thin film moisture barrier is deposited directly onto the device or laminated to the device, then the moisture barrier is flexible and easier to handle, but it fails to maintain adhesion and moisture resistance over long-term exposure to heat and moisture
Solution Approach 1:
The patent applies composite materials by creating a multi-layer structure consisting of a polymer layer, an interfacial layer, and a barrier layer. Each layer serves a specific function: the polymer layer provides flexibility and baseline moisture resistance, the interfacial layer enhances adhesion between layers, and the barrier layer provides superior moisture vapor transmission resistance. This composite structure resolves the contradiction by combining the flexibility of thin film polymers with the long-term reliability of inorganic barrier layers, preventing delamination and maintaining performance under damp heat conditions.
Solution Approach 2:
The patent implements the nested doll principle by depositing the interfacial layer within or onto the polymer layer, and then depositing the barrier layer onto the interfacial layer. This nested multi-layer configuration allows each layer to contribute its specific properties while maintaining strong inter-layer adhesion, thereby achieving both flexibility and long-term reliability in the composite moisture barrier structure.
2Reliability
If conventional moisture barriers are used, then initial moisture resistance is provided, but delamination occurs upon long term exposure to damp heat
Solution Approach 1:
The patent applies preliminary action by depositing the interfacial layer between the polymer layer and the barrier layer before final assembly. This interfacial layer is specifically designed to prevent delamination under damp heat conditions by providing strong adhesion promoters and chemical bonding sites. The preliminary placement of this protective interfacial layer ensures that when the device undergoes long-term exposure to damp heat, the layers remain bonded together, preventing the delamination that occurs in conventional single-layer or simple multi-layer barriers.
3Reliability
If a multi-layer structure with interfacial and barrier layers is implemented, then long-term adhesion and moisture resistance are maintained, but the device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the moisture barrier into three distinct functional layers: a polymer layer for flexibility and baseline protection, an interfacial layer for adhesion enhancement, and a barrier layer for superior moisture resistance. This segmentation allows each layer to be optimized for its specific function and deposited using appropriate techniques, achieving high reliability while maintaining a manageable structure that can be integrated into existing manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances the durability and longevity of the moisture barrier, maintaining initial peel strength and water vapor transmittance rate performance for extended periods, outperforming conventional barriers by providing a synergistic physical and chemical resistance to moisture ingress.
Implementation Method 1
The interfacial layer may be formed by atomic layer deposition (ALD)
Implementation Method 2
The barrier layer associated with the interfacial layer may be deposited by plasma enhanced chemical vapor deposition (PECVD)
Data Source
AI summary
A moisture barrier, device or product having a moisture barrier or a method of fabricating a moisture barrier having at least a polymer layer, and interfacial layer, and a barrier layer. The polymer layer may be fabricated from any suitable polymer including, but not limited to, fluoropolymers such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), or ethylene-tetrafluoroethylene (ETFE). The interfacial layer may be formed by atomic layer deposition (ALD). In embodiments featuring an ALD interfacial layer, the deposited interfacial substance may be, but is not limited to, Al2O3, AlSiOx, TiO2, and an Al2O3/TiO2 laminate. The barrier layer associated with the interfacial layer may be deposited by plasma enhanced chemical vapor deposition (PECVD). The barrier layer may be a SiOxNy film.