Multilayer Mold Release Film for Wrinkle-Free Semiconductor Molding
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Solution Overview
Problem
Conventional mold release films often transfer wrinkles and strain to molded bodies due to insufficient flexibility and deformation, leading to suboptimal external appearances and workability issues during semiconductor device manufacturing.
Innovation Solution
A multilayer mold release film structure is developed, comprising a mold release layer, a first base material layer, and a second base material layer, with specific resin compositions and thicknesses to enhance flexibility and elongation properties, while controlling tensile strength and breaking strength to prevent wrinkles and strain.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the thickness of the mold release film is reduced to increase flexibility and elongation, then the film can better accommodate deformation and prevent wrinkles, but the workability decreases because the film cannot be made sufficiently stiff
Solution Approach 1:
The patent employs a multilayer composite structure consisting of a mold release layer and a base material layer. The base material layer provides the necessary stiffness and strength for handling and operation, while the mold release layer contributes flexibility and elongation properties. This composite construction allows the film to maintain both workability and deformation accommodation capabilities simultaneously.
Solution Approach 2:
Different layers of the mold release film are designed with distinct properties tailored to specific functional requirements. The base material layer is optimized for mechanical strength and stiffness to ensure ease of operation, while the mold release layer is designed with superior flexibility and elongation to prevent wrinkles during molding. Each layer performs its specialized function, resolving the contradiction between overall film flexibility and local stiffness requirements.
2Reliability
If the mold release film is vacuum-adhered to the cavity recess, then the film can be securely positioned, but the film is drawn into the suction port causing deformation and potential wrinkle formation
Solution Approach 1:
The patent optimizes the physical parameters of the mold release film, specifically its tensile strength and breaking strength, to fall within predetermined ranges. This parameter control ensures that the film has sufficient strength to resist excessive deformation during vacuum adhesion while maintaining adequate flexibility for proper conforming to the cavity recess. The balanced parameter selection prevents the film from being drawn excessively into the suction port.
3Productivity
If compression molding is performed with the pedestal raised to compress the resin material, then the molding process is completed, but the cavity depth becomes shallow generating spaces between the film and cavity surface causing strain and wrinkles
Solution Approach 1:
The mold release film is pre-designed with optimized thickness and material properties before the molding process begins. The film's initial configuration and mechanical properties are predetermined to accommodate the expected deformation during compression molding. This preliminary preparation ensures that when the pedestal is raised and compression occurs, the film can withstand the changing cavity depth without developing excessive strain or wrinkles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents wrinkles and strain on the mold release film, ensuring a favorable external appearance of molded bodies and maintaining workability, allowing for efficient semiconductor device manufacturing.
Implementation Method 1
a suction port for evacuation is provided around a cavity recess of a lower metal mold so that a mold release film is vacuum-adhered to the inner surface of the cavity recess. After disposing the mold release film so as to cover both the cavity recess and the suction port around it, the air between the mold release film and the cavity recess is sucked by the suction port and evacuated
Data Source
AI summary
The mold release film has a multilayer structure in which a mold release layer, a first base material layer, and a second base material layer are laminated. The mold release layer constitutes a mold release surface, and the second base material layer constitutes a surface of the mold release film on an opposite side of the mold release surface. The mold release layer contains one or two or more selected from a silicone resin, a fluororesin, a melamine resin, an epoxy resin, and a phenolic resin. The first base material layer is formed by a stretched or un-stretched film containing one or two or more selected from a polyester resin, a polyolefin resin, and a polyamide resin. The second base material layer is formed by a stretched or un-stretched film containing one or two or more selected from a polyester resin, a polyolefin resin, and a polyamide resin.