Multilayer Structure with Natural Substrate and Molded Plastic
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Solution Overview
Problem
Existing electronics multilayer structures face challenges in achieving size, weight, and material savings while maintaining aesthetic appeal and environmental sustainability, particularly when electronics need to be exposed to the user environment and require proximity to the use environment, as traditional materials are often not eco-friendly and add unnecessary thickness or weight.
Innovation Solution
A multilayer structure comprising a substrate with organic, naturally grown materials such as wood, leather, or natural textiles, combined with a molded plastic layer that embeds circuitry, allowing for a thin, lightweight, and aesthetically pleasing design that is environmentally friendly and recyclable, with optional transparent or translucent properties to enable light transmission and visual features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional plastic materials are used for molded layers, then protective and aesthetic functions are achieved, but environmental sustainability and recyclability deteriorate
Solution Approach 1:
The patent changes the material parameter from conventional plastic to biodegradable plastic, transforming the environmental characteristics while maintaining the protective function. This parameter change enables the molded layer to degrade naturally after use, reducing environmental stress and improving recyclability.
Solution Approach 2:
The patent employs composite material structures where biodegradable plastic is combined with natural substrates (wood, paper, textile). This composite approach achieves both protective functionality and environmental sustainability, as the natural substrates are inherently biodegradable and the biodegradable plastic layer provides protection while maintaining recyclability.
2Reliability
If masking layers are placed on top of circuit boards, then electronics are protected and aesthetically improved, but overall thickness and weight increase
Solution Approach 1:
The patent merges the circuit board substrate and the molded layer into an integrated structure where the biodegradable plastic is molded directly onto the natural substrate that hosts the electronics. This merging eliminates the need for separate masking layers, reducing overall thickness and weight while maintaining protection and aesthetic functions.
Solution Approach 2:
The natural substrate serves multiple functions simultaneously: it provides structural support, aesthetic appearance, and serves as the base for electronics mounting. The biodegradable plastic layer provides protection, aesthetic enhancement, and environmental sustainability. This multi-functionality reduces the need for additional components, thereby reducing weight and thickness.
3Strength
If traditional materials are used, then structural integrity and protection are achieved, but environmental friendliness and recyclability worsen
Solution Approach 1:
The patent changes the material composition parameter to use biodegradable plastics and natural substrates instead of conventional materials. This parameter change maintains structural integrity through proper material selection and processing while enabling biodegradation and improving waste management, thereby reducing environmental harm.
Solution Approach 2:
The patent converts the potential harm of plastic waste into a benefit by using biodegradable plastics that can naturally decompose. The material that would traditionally cause environmental pollution is transformed into an environmentally friendly material that returns to nature, turning a harmful factor into a beneficial feature for sustainability.
Data Source
AI summary
An integrated multilayer structure for hosting electronics, includes a first substrate including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture. The first substrate has a first side facing a predefined front side of the structure, the first side of the first substrate being optionally configured to face a user and/or use an environment of the structure or of its host device. The first substrate has an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto the second side of the first substrate so as to at least partially cover it. The first substrate further includes circuitry provided on the second side of the first substrate, wherein the circuitry is at least partially embedded in the molded material of the plastic layer. A related method of manufacture is also presented.