Multilayer Electronic Packaging Sheet Fluff Control
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Solution Overview
Problem
Conventional electronic device packaging sheets face challenges in inhibiting the generation of fluffs and burrs while maintaining good moldability, as existing methods either fail to sufficiently prevent these issues or compromise moldability.
Innovation Solution
An electronic device packaging sheet with a multilayer structure, where substrate layers A and B, composed of different thermoplastic resins, are alternately laminated, with the thickness of layer A being greater than layer B, effectively inhibiting fluffs and burrs while maintaining moldability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single-layer substrate is used for packaging electronic devices, then the manufacturing process is simple, but fluffs and burrs are generated during molding that can fall into accommodation sections and cause faults
Solution Approach 1:
The patent applies composite materials by creating a multilayer substrate structure where a first substrate layer (10-60 μm) and a second substrate layer (1-50 μm) made of different thermoplastic resins are alternately laminated. This composite structure suppresses the generation of fluffs and burrs during molding while maintaining ease of manufacture, as the layered configuration provides differential deformation characteristics that prevent defect formation.
Solution Approach 2:
The patent segments the substrate into multiple thin layers (first substrate layer and second substrate layer) with different thicknesses and material compositions. By dividing the single-layer structure into alternating layers, each layer can deform independently during molding, preventing the generation and adhesion of fluffs and burrs to electronic devices.
2Object-affected harmful factors
If the thickness of substrate layers is reduced to inhibit fluffs and burrs, then defect generation is suppressed, but moldability to achieve desired shapes deteriorates
Solution Approach 1:
The patent applies asymmetry by setting different thickness ranges for the first substrate layer (10-60 μm) and the second substrate layer (1-50 μm), with the average thickness of the first layer being greater than that of the second layer. This asymmetric thickness configuration optimizes both defect suppression and moldability, as the thicker first layer provides structural integrity for shaping while the thinner second layer suppresses fluff and burr generation.
Data Source
AI summary
An electronic device packaging sheet provided with a substrate sheet in which a substrate layer A and a substrate layer B are alternately laminated, wherein: the thickness of an individual substrate layer A is 10-60 μm; the thickness of an individual substrate layer B is 1-50 μm; the average value of the thickness of an individual substrate layer A is greater than the average value of the thickness of an individual substrate layer B; and the substrate layer A and the substrate layer B include a different thermoplastic resin as a main component.