Multilayer Patch Antenna Using Adhesive Carrier for Bandwidth
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Solution Overview
Problem
Conventional multilayer patch antennas have complex constructions, making it difficult to upgrade simple patch antennas into multilayer antennas without altering their existing components, such as ground and radiation faces, which are typically made of dielectric materials like ceramics.
Innovation Solution
A simpler construction method for multilayer patch antennas involves attaching a three-dimensional patch element with a significant height above the radiation face using an adhesion layer, such as double-sided adhesive tape, allowing for improved electrical characteristics without the need for additional carrier structures, and enabling greater longitudinal and transverse extensions of the patch element compared to the radiation face.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional commercial patch antennas are supplemented to form multilayer antennas using additional dielectric carrier layers and patch faces, then antenna performance (bandwidth, gain) is improved, but construction complexity increases significantly
Solution Approach 1:
The patent changes the fundamental parameter of the carrier layer from dielectric material to magnetic material with specific permeability characteristics. This allows the upper patch face to be directly mounted on the magnetic carrier layer without requiring additional dielectric layers, simplifying the construction while maintaining improved antenna performance through magnetic field interaction
Solution Approach 2:
The patent uses a composite structure combining a magnetic carrier layer with specific permeability characteristics and a dielectric layer with specific permittivity characteristics. This composite approach enables the antenna to achieve enhanced bandwidth and gain while reducing overall construction complexity by integrating multiple functions into the material properties themselves
2Adaptability or versatility
If additional dielectric carrier layers are produced and positioned on existing patch antennas, then multilayer antenna functionality is achieved, but manufacturing complexity and assembly difficulty increase
Solution Approach 1:
The patent segments the antenna structure into distinct functional layers: a magnetic carrier layer providing magnetic field interaction and structural support, and a separate dielectric layer providing electrical insulation and field distribution. This segmentation allows each layer to be optimized independently and simplifies assembly by eliminating the need to produce complex integrated carrier structures
Solution Approach 2:
The patent uses the existing lower patch antenna structure as a template and copies its essential functionality to the upper patch face, but simplifies the implementation by using a magnetic carrier layer instead of requiring a complete replication of the original dielectric carrier structure. This allows easy integration while maintaining multilayer functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in improved antenna characteristics, including increased bandwidth and gain, while maintaining a simpler construction process that does not require altering existing commercial patch antennas, allowing for easy integration of the three-dimensional patch element using adhesion layers, which can be as thick as 1.5 mm or more.
Implementation Method 1
attaching a three-dimensional patch element with a significant height above the radiation face using an adhesion layer, such as double-sided adhesive tape
Implementation Method 2
a first dielectric layer arranged between the ground face and the radiation face and a second dielectric layer arranged between the radiation face and the patch element
Data Source
AI summary
A multilayer antenna of planar construction comprises an electrically conductive ground face and a conductive radiation face which is arranged with lateral spacing from the ground face and extends substantially parallel thereto. A dielectric carrier is arranged between the ground face and the radiation face. Above the radiation face there is a carrying means. Above the carrying means there is provided an electrically conductive patch element. The carrying means has a thickness or height which is less than the thickness or height of the patch element.