Multi-Layer Pattern Transfer Printing with Single-Step Laser Release
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Solution Overview
Problem
Current transfer printing technologies face challenges in efficiently printing multi-layered features with precise alignment and high throughput, especially in producing complex electric circuits and photovoltaic solar cells.
Innovation Solution
The development of a pattern transfer sheet and method that utilize a source substrate with trenches arranged in a pattern, filled with a multi-layered printing paste stack. This stack is released onto a receiving substrate using a single illumination step by a laser beam, allowing for the formation of multi-layered features such as conductive lines and selective emitter lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multi-layered features are printed using conventional transfer printing technologies, then the production of complex electric circuits and photovoltaic solar cells can be achieved, but the alignment precision and throughput are insufficient
Solution Approach 1:
The source substrate is divided into multiple trenches arranged in a pattern, with each trench designed to hold a specific layer of printing paste. This segmentation allows for precise spatial organization of multiple layers while enabling simultaneous release of all layers through a single laser illumination step, thereby improving both alignment precision and throughput
Solution Approach 2:
Multiple printing paste layers are combined into a single multi-layered stack structure within the trenches on the source substrate. This merging allows all layers to be transferred together in one illumination event, achieving high throughput while maintaining precise alignment through the unified stack structure
Solution Approach 3:
The printing paste layers are pre-assembled into a multi-layered stack structure within the trenches before the transfer process. This preliminary arrangement ensures that when laser illumination occurs, all layers are already positioned correctly and will be released simultaneously with precise alignment to the receiving substrate
2Ease of manufacture
If multiple printing paste layers are transferred using conventional methods, then multi-layered features can be formed, but the process complexity and time consumption increase
Solution Approach 1:
The invention employs a periodic action where a single laser illumination event simultaneously releases all printing paste layers from the trenches. This periodic release mechanism eliminates the need for sequential transfer steps, reducing both process complexity and time consumption while maintaining the ability to form multi-layered features
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the cost-effective and high-throughput production of multi-layered features with improved precision and alignment, enhancing the performance and efficiency of electric circuits and photovoltaic solar cells.
Implementation Method 1
radiating light towards the front surface of the source substrate, to remove at least one piece of the coating material from the source substrate and deposit said removed at least one piece onto the receiving substrate
Implementation Method 2
illumination by a laser beam, allowing for the formation of multi-layered features
Data Source
AI summary
Pattern transfer sheets and methods are provided, providing multi-layer paste stack lines that are printed on a receiving substrate in a single illumination step. The paste is filled layer-by-layer, possibly having different materials in different layers, with layer thickness controlled by parameters of the filling elements, e.g., in case of blades, the pressure, angle, velocity and flexibility (material) of the blade. Specifically, a bottom layer of the stack may be configured to interface the receiving substrate while one or more top layers may be configured to optimize the quality of the printed features. For example, bottom layers may comprise to bind to the substrate, to modify the substrate (e.g., forming selective emitter (SE) therein) and/or provide a barrier from top layer(s) which may not be compatible with the substrate (e.g., copper on silicon). Releasing material may be used to support the single step release of the stack line.