Multilayer PCB Antenna Array with Air Gap for Satellite RF
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Solution Overview
Problem
Current data networks are inefficient in handling high volumes of low-bandwidth devices, leading to low useful-to-useless data ratios due to uncoordinated communication, which hampers the commercial viability of large-scale sensor network deployments.
Innovation Solution
A multilayer printed circuit board (PCB) with multiple antennas and RF chains, where metal patches are arranged in a square with an air gap, optimized by dimensions, orientation, and spacing based on carrier frequency, bandwidth, and directionality, enables efficient propagation and processing of RF signals for satellite communications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple low-bandwidth devices communicate in an uncoordinated environment, then device connectivity is achieved, but network efficiency deteriorates with useful-to-useless data ratio below 10%
Solution Approach 1:
The patent changes the communication parameter from uncoordinated random access to coordinated scheduled access with specific time slots and frequency resources allocated to each device, transforming the network from an inefficient broadcast medium into a structured communication system that minimizes collisions and maximizes useful data transmission
Solution Approach 2:
The patent segments the network communication into discrete time slots and frequency resources, dividing the shared medium into dedicated channels for different devices. This segmentation prevents uncoordinated access conflicts and ensures that each low-bandwidth device has guaranteed transmission opportunities, dramatically improving network efficiency
2Volume of moving object
If antenna elements are placed close together on a PCB, then device size is reduced, but signal interference increases affecting communication quality
Solution Approach 1:
The patent applies local quality by creating distinct electromagnetic environments for each antenna element through individual grounding structures and isolation techniques. Each antenna element is treated with localized quality enhancements including dedicated ground planes and spacing patterns that prevent near-field interference while maintaining overall compact device dimensions
Solution Approach 2:
The patent introduces intermediary structures such as ground planes, isolation barriers, and decoupling networks between closely spaced antenna elements. These intermediaries act as electromagnetic shields that prevent direct coupling and interference between adjacent antennas, enabling compact placement without sacrificing signal quality
3Productivity
If RF signals are processed through multiple layers and components, then signal processing capability is enhanced, but signal loss and latency increase
Solution Approach 1:
The patent transitions from planar two-dimensional PCB routing to three-dimensional vertical stacking with multiple signal layers. RF signals propagate through vertically stacked microstrip or stripline layers, reducing the physical path length and number of via transitions required. This dimensional change enables enhanced processing capability through additional antenna elements and RF chains while minimizing latency by reducing signal travel distance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the efficiency of satellite communication by optimizing antenna design and beamforming, maintaining signal quality under motion, and reducing latency and resource consumption, thereby improving the commercial viability of large-scale sensor networks.
Implementation Method 1
N antenna elements operate to enable propagation of RF (radio frequency) signals
Implementation Method 2
an air gap is located between the N metal patches and the N antenna elements
Data Source
AI summary
Apparatuses, methods, and systems for a printed circuit board that includes multiple antennas, and operates to support satellite communications, are disclosed. One apparatus includes a first flat panel element. The first flat panel element includes a multilayer PCB (printed circuit board). The multilayer PCB includes a first exterior layer comprising N antenna elements, and a second exterior layer comprising N RF (radio frequency) chains operative to process the RF signals, each of the N RF chains electrically connected to a one of the N antenna elements, and N metal patches arranged in a square, wherein an air gap is located between the N metal patches and the N antenna elements, wherein dimensions, orientation, and spacing between the N metal patches and the N antenna elements are selected based on a carrier frequency, bandwidth, and directionality of the propagated RF signals.