Multilayer PCB Antenna Feed Integration for Bandwidth Retention
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Solution Overview
Problem
Integrating antenna and antenna feed boards with transceiver and baseband boards in 5G communication systems is challenging due to bulkiness, high cost, and inefficiencies, particularly in multi-layer PCBs, leading to increased form factor and power loss.
Innovation Solution
The integration of antenna feed onto a multi-layer printed circuit board (PCB) is achieved by using aperture coupled feeding techniques and interconnecting vias to maintain electrical connections while minimizing mechanical complexity and cost, with a thickness of less than 2.54 mm, enabling mass production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If antenna and antenna feed boards are integrated onto a multi-layer PCB, then device complexity and form factor are reduced, but manufacturing precision and signal transmission efficiency deteriorate due to bandwidth loss
Solution Approach 1:
The patent transitions from a planar two-dimensional feed structure to a three-dimensional structure utilizing multiple PCB layers. The feed network is distributed across different layers with vertical interconnections via vias, allowing the signal path to exploit the third dimension (layer stacking) to maintain electrical performance while achieving physical integration.
Solution Approach 2:
The antenna feed structure is nested within the multi-layer PCB architecture. Conductive traces and feed elements are embedded between dielectric layers, with each layer containing portions of the feed network. This nesting approach integrates the feed board functionality into the existing PCB structure without compromising signal integrity.
2Ease of manufacture
If antenna feed is integrated onto multi-layer PCB, then production cost decreases, but reliability deteriorates due to increased mechanical complexity
Solution Approach 1:
The patent merges the antenna feed board with the transceiver PCB into a single integrated structure. The feed network, previously a separate component, is combined with the PCB trace layers and ground planes, eliminating the need for separate mounting and interconnections while maintaining signal transmission reliability through controlled impedance design.
Solution Approach 2:
The patent modifies key geometric parameters of the feed structure, including trace widths, spacing, and layer distances, to optimize impedance matching and signal transmission. By carefully controlling these parameters during PCB fabrication, the design achieves reliable signal transmission while benefiting from standard PCB manufacturing processes.
3Volume of moving object
If antenna feed board is integrated with transceiver board, then overall form factor is reduced, but power loss increases
Solution Approach 1:
The patent segments the feed network into multiple discrete sections distributed across different PCB layers. Each layer contains specific portions of the feed path, allowing the signal to be routed through optimized segments rather than a single long trace. This segmentation reduces cumulative losses by minimizing the total trace length and number of discontinuities.
Solution Approach 2:
The patent introduces via holes as intermediary elements to connect feed traces between layers. These vias are strategically positioned and designed with appropriate plating to minimize insertion loss while enabling vertical signal transitions. The via structures act as controlled impedance transitions that maintain signal integrity during layer transitions.
Data Source
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AI summary
The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). A transmitter includes apparatus for integrating the antenna feed into a multilayer PCB. The apparatus includes an antenna element disposed over the multilayer PCB having slot openings that substantially overlap and that enable an RF signal to be coupled from a printed transmission line located on one of the multilayer PCB conductive layers. The multilayer PCB board hosts at least one transceiver unit and a baseband unit such that the antenna feed, transceiver and baseband units are integrated on a single multilayer PCB board without degradation of antenna bandwidth and efficiency.