Multi-Layer PCB Antenna Module With Coplanar Waveguide Isolation
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Solution Overview
Problem
Existing millimeter wave band communication technologies face challenges in implementing antennas and RFICs with minimal signal loss and attenuation, requiring numerous stacked layers and high production costs, while also experiencing signal interference and phase differences in patch array antennas.
Innovation Solution
A multi-layered antenna module structure with a PCB having multiple array antennas and coplanar waveguides, minimizing the number of stacked layers and signal interference by using ground layers to separate array antennas, and incorporating a controller to select the antenna with the highest signal strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If stripline or microstrip multi-layer circuit is used to implement millimeter wave antenna, then antenna performance and bandwidth are improved, but the number of stacked layers increases to 7-10 layers and production cost increases
Solution Approach 1:
The patent combines the antenna elements and ground layers into a integrated multi-layer structure where ground layers are shared between adjacent antenna elements. This merging approach allows achieving the required shielding and signal isolation without needing separate ground layers for each antenna, thereby reducing the total layer count from 7-10 layers to a more compact structure while maintaining antenna performance.
Solution Approach 2:
The ground layers in the patent serve multiple functions simultaneously: they provide electromagnetic shielding, act as reference planes for signal transmission, and serve as ground connections for multiple antenna elements. This multi-functionality allows the same ground layer to support multiple antenna elements, reducing the overall number of layers required compared to dedicated ground layers for each antenna.
2Object-affected harmful factors
If more stacked layers are used in multi-layer circuit antenna package, then signal isolation and antenna performance are improved, but production cost and manufacturing complexity increase
Solution Approach 1:
Adjacent antenna elements share common ground layers, merging the grounding infrastructure across multiple antenna elements. This reduces the total number of ground layers required, thereby decreasing manufacturing complexity and production cost while still providing adequate signal isolation through the shared ground structure.
Solution Approach 2:
The patent utilizes the vertical dimension by strategically positioning ground layers at specific heights and locations within the multi-layer structure. By optimizing the vertical placement of ground layers rather than simply increasing the total number of layers, the design achieves effective signal isolation with reduced layer count, simplifying manufacturing.
3Adaptability or versatility
If patch array antenna structure is used for millimeter wave communication, then broadband signal transmission is enabled, but signal phase difference between patches occurs
Solution Approach 1:
The patent implements local variations in the antenna element design, including adjusting the size, shape, and positioning of individual patch elements and their corresponding ground layers. These localized adjustments compensate for phase differences between adjacent patches, enabling broadband operation while maintaining phase coherence across the array.
Solution Approach 2:
The design employs parameter optimization of the patch antenna elements, including varying the patch dimensions, spacing, and ground layer configurations to control the electrical characteristics. By carefully adjusting these parameters, the patent achieves broadband signal transmission while minimizing phase differences between array elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces signal loss, minimizes interference, and lowers production costs by optimizing the antenna module structure for millimeter wave band communication, enabling efficient broadband signal transmission.
Implementation Method 1
First to third signal lines connected to the first to third array antennas form first to third coplanar waveguide structures
Implementation Method 2
minimizes interference by using ground layers to separate array antennas
Data Source
AI summary
An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; a radio frequency integrated circuit (RFIC) disposed on a first surface among outermost surfaces of the PCB; a first array antenna disposed on a second surface, perpendicular to the first surface, among the outermost surfaces of the PCB; a second array antenna disposed on a third surface, perpendicular to the first and second surfaces, among the outermost surfaces of the PCB; and a third array antenna disposed on a fourth surface, perpendicular to the second and third surfaces, among the outermost surfaces of the PCB. First to third signal lines connected to the first to third array antennas form first to third coplanar waveguide structures in which first to third ground regions are formed, respectively.