Multi-Layer PCB Antenna Module for Low-Loss Millimeter-Wave Links
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Solution Overview
Problem
The challenge in millimeter wave band communication is the high signal attenuation and the need for a short distance between the antenna and the RFIC to minimize loss, which is difficult to achieve with existing multi-layer circuit technologies due to high production costs.
Innovation Solution
A multi-layered antenna package is designed with a PCB having multiple layers, where the RFIC is placed on one surface and array antennas are disposed on opposing surfaces, forming coplanar waveguide structures with ground regions to minimize signal phase difference and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multi-layer circuit is designed with stripline or microstrip to achieve ideal antenna performance, then antenna performance is improved, but the number of layers increases to 7-10 layers and production costs increase
Solution Approach 1:
The patent combines the antenna elements and signal transmission lines into a single integrated PCB structure, eliminating the need for separate cable connections between antenna and RFIC. This integration reduces the number of required PCB layers while maintaining antenna performance, directly resolving the contradiction between performance and complexity.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement by disposing array antennas on different surfaces (first surface, second surface, third surface) of the PCB perpendicular to each other. This dimensional approach allows signal transmission without requiring excessive layers, reducing the layer count from 7-10 to a more manageable number while preserving antenna functionality.
2Loss of energy
If the distance between antenna and RFIC is reduced to minimize signal loss, then signal attenuation is reduced, but the device structure becomes more complex
Solution Approach 1:
The patent integrates the RFIC mounting surface and antenna elements within the same PCB structure, with the RFIC disposed on the first surface and array antennas disposed on the first, second, and third surfaces. This integration minimizes the distance between antenna and RFIC, reducing signal loss while avoiding the need for complex external cable connections.
3Adaptability or versatility
If array antennas are disposed on multiple surfaces to transmit signals in multiple directions, then coverage is improved, but signal interference between antennas increases
Solution Approach 1:
The patent employs asymmetric spatial arrangement of array antennas on different surfaces perpendicular to each other, with each antenna oriented in a different direction (first surface, second surface, third surface). This asymmetric configuration optimizes signal transmission in multiple directions while minimizing mutual interference between antennas by exploiting the three-dimensional spatial separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces signal loss and attenuation, lowers production costs, and minimizes interference between array antennas, enabling efficient millimeter wave band communication.
Implementation Method 1
First to third signal lines connected to the first to third array antennas form first to third coplanar waveguide structures in which first to third ground regions are formed, respectively
Data Source
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AI summary
An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; a radio frequency integrated circuit (RFIC) disposed on a first surface among outermost surfaces of the PCB; a first array antenna disposed on a second surface, perpendicular to the first surface, among the outermost surfaces of the PCB; a second array antenna disposed on a third surface, perpendicular to the first and second surfaces, among the outermost surfaces of the PCB; and a third array antenna disposed on a fourth surface, perpendicular to the second and third surfaces, among the outermost surfaces of the PCB. First to third signal lines connected to the first to third array antennas form first to third coplanar waveguide structures in which first to third ground regions are formed, respectively.