Multi-Layer PCB Power Converter Cooling for Higher Power Density
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Solution Overview
Problem
Power converters face challenges in achieving efficient thermal dissipation with reduced device volume due to increased loss and decreased surface area, necessitating improvements in PCB construction and cooling mechanisms.
Innovation Solution
The implementation of an Integrated Multi-Layer Cooling (IMLC) structure that vertically stacks multiple PCBs, sorts components by thermal properties, and incorporates active liquid cooling through a bottom-mounted cold plate heatsink to optimize thermal performance and reduce volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the overall size of the converter and individual electronic components decrease, then the power density increases, but the loss increases and the surface area available to dissipate heat decreases
Solution Approach 1:
The patent transitions from traditional single-layer PCB cooling to a multi-layer stacked PCB architecture with liquid cooling channels integrated between layers. This dimensional change from 2D to 3D stacking allows heat dissipation surfaces to be distributed across multiple layers, increasing the effective cooling surface area while maintaining a compact overall volume, thus resolving the contradiction between reduced converter size and increased power density
2Volume of moving object
If the overall size of the converter and individual electronic components decrease, then the power density increases, but the surface area available to dissipate heat decreases
Solution Approach 1:
The patent employs multi-layer stacking where each PCB layer provides additional heat dissipation surfaces. The liquid cooling channels are integrated within the stacked structure, creating internal heat dissipation pathways that do not increase the external footprint. This allows the heat dissipation surface area to be maintained or increased while the converter volume is reduced through efficient vertical stacking
Solution Approach 2:
The liquid cooling channels are nested within the multi-layer PCB structure, with cooling passages integrated between and within the stacked layers. This nesting approach allows the cooling system to be embedded within the converter volume rather than adding external cooling components, thereby maintaining compact size while providing adequate heat dissipation surface area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The IMLC structure achieves 31% greater power density with reduced converter size by efficiently utilizing three-dimensional space, improving thermal dissipation while maintaining thermal performance.
Implementation Method 1
a liquid cooling mechanism mounted to the first PCB and removing heat from the circuitry components
Implementation Method 2
liquid cooling mechanism mounted to the first PCB and removing heat from the circuitry components
Data Source
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AI summary
A power converter includes an integrated multi-layer cooling structure. The power converter includes a plurality of printed circuit boards (PCBs) stacked together in a generally vertical arrangement. A liquid cooling mechanism is attached to a lower-most PCB, and high loss circuitry components are attached to an opposite side of the lower-most PCB. Low loss circuitry components are attached to further PCBs. Magnetic components may be attached to the further PCBs. The high loss components are actively cooled by the liquid cooling mechanism and the low loss components and magnetic components are passively cooled. The liquid cooling mechanism may be a cold plate heatsink. The power converter may include intermediate PCBs disposed between the upper-most PCB and the lower-most PCB, with low loss circuitry components attached to the intermediate PCBs.