Multilayer PCB Reverse Engineering with Nondestructive CT Imaging

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Solution Overview

Problem

Existing methods for determining interconnections on inner layers of multilayer printed circuit boards (PCBs) are destructive, requiring substantial time and effort, and fail to reproduce the PCBs accurately due to the hidden nature of these interconnections, leading to the inability to restore legacy systems.

Innovation Solution

A nondestructive method using computed tomography techniques to generate a 2D image of conductive material patterns on PCB layers by evaluating voxels in a 3D data set, aligning the reference plane with the PCB geometry, and adjusting voxel coordinates to create a representative image, which can be converted into a computer-aided manufacturing file.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of information

If destructive removal techniques are used to reveal hidden interconnections on inner PCB layers, then the interconnection information becomes accessible, but the PCB is destroyed and cannot be preserved

Engineering Contradiction:

Improveinterconnection information accessibilityVSAvoidPCB preservation

Core Design Contradiction:

Loss of informationVSReliability

Solution Approach 1:

The patent replaces mechanical destruction (sanding, drilling, cutting) with nondestructive imaging techniques including X-ray computed tomography, optical microscopy, and interferometry to visualize and extract interconnection information without physical damage to the PCB

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent creates digital 3D models and 2D representations (Gerber files) of the PCB layers and interconnections through nondestructive scanning, producing accurate copies of the physical structure that can be used for reproduction without damaging the original PCB

Inventive Principle:

Principle #26Copying

2Loss of information

If manual layer removal and visual inspection are used to determine interconnections, then the interconnection pattern can be identified, but substantial time and effort are required

Engineering Contradiction:

Improveinterconnection pattern identificationVSAvoidreverse engineering time

Core Design Contradiction:

Loss of informationVSLoss of time

Solution Approach 1:

The patent changes the measurement parameters from manual visual inspection to automated nondestructive imaging with high-resolution scanning, transforming the process from labor-intensive manual work to rapid automated data acquisition and processing

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent implements automated image processing algorithms and computer vision techniques that automatically extract interconnection patterns from scanned images without requiring manual inspection or interpretation by operators

Inventive Principle:

Principle #25Self-service

3Difficulty of detecting and measuring

If conventional imaging techniques are used to capture PCB layers, then the surface features are visible, but the hidden inner layer interconnections remain undetected

Engineering Contradiction:

Improvesurface feature visibilityVSAvoidinner layer interconnection detection

Core Design Contradiction:

Difficulty of detecting and measuringVSLoss of information

Solution Approach 1:

The patent transitions from 2D surface imaging to 3D volumetric scanning using computed tomography and other three-dimensional imaging techniques, enabling visualization of hidden inner layers and interconnections that are not accessible from surface views

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent uses nondestructive imaging modalities (X-rays, optical waves) as intermediaries to penetrate through outer PCB layers and dielectric materials to reveal the hidden conductive patterns and interconnections on inner layers without direct physical contact or destruction

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the nondestructive reproduction of PCB layers, preserving the original board and allowing for accurate reproduction of interconnections, thus restoring legacy systems without destruction.

Implementation Method 1

A nondestructive method using computed tomography techniques to generate a 2D image of conductive material patterns on PCB layers by evaluating voxels in a 3D data set

Methodology Applied

Scientific EffectComputed Tomography: Tomography

Data Source

PatentUS12450794B2Method for nondestructive reverse-engineering of layers of printed circuit board

Publication Date: 2025.10.21 RJ MATTHEWS LLC DBA TETRAHIVE TECHNOLOGIES

AI summary

A nondestructive method generates a representation of a pattern of electrically conductive material on at least one layer of a multiple-layer printed circuit board (PCB). The method generates a plurality of imaging slices by evaluating the voxels in a 3D nondestructive data set to identify voxels having intensities representing electrically conductive material. The method establishes a reference plane that includes at least one voxel identified in a selected one of the plurality of slices. The method determines a distance of other voxels from the reference plane and adjusts the respective 3D coordinate of each other voxel to effectively position a respective adjusted voxel in the reference plane. The method generates a two-dimensional (2D) image that includes the at least one voxel and the adjusted voxels in the reference plane. The 2D image represents the pattern of electrically conductive material in the at least one layer.