Multilayer PCB Layout for Integrated Active Filter and Inverter

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Solution Overview

Problem

Conventional power conversion devices require separate mounting boards for active filter and inverter circuits, leading to increased size, cost, and complexity.

Innovation Solution

Integration of active filter and inverter circuits on a single multilayer printed wiring board, with non-overlapping conductive patterns to minimize noise interference and shared components to reduce size and cost.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate mounting boards are used for active filter circuit and inverter circuit, then noise interference is reduced, but device size and cost increase

Engineering Contradiction:
Improvenoise interference reductionVSAvoiddevice size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The patent merges the active filter circuit and inverter circuit onto a single multilayer printed wiring board, integrating previously separate mounting boards into one unified structure, thereby reducing device size while managing noise through layer separation

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from a two-dimensional separate board layout to a three-dimensional multilayer board structure, utilizing vertical layering to separate high-voltage and low-voltage patterns, thus reducing noise interference while maintaining integration

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If separate mounting boards are used for active filter circuit and inverter circuit, then noise interference is reduced, but manufacturing cost increases

Engineering Contradiction:
Improvenoise interference reductionVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple circuit functions into a single printed wiring board, reducing the total number of components and assembly steps, which lowers manufacturing cost while maintaining noise isolation through multilayer design

Inventive Principle:
Principle #5Merging (Combining)

3Area of stationary object

If conductive patterns are allowed to overlap on multilayer board, then space utilization improves, but noise interference increases

Engineering Contradiction:
Improvespace utilizationVSAvoidnoise interference
Core Design Contradiction:
Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent utilizes the vertical dimension in multilayer board design to separate high-voltage and low-voltage conductive patterns into different layers, allowing horizontal overlap in plan view while maintaining vertical isolation to prevent noise interference

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Measurement precision

If detection patterns are isolated from high-voltage patterns, then detection accuracy improves, but design flexibility decreases

Engineering Contradiction:
Improvedetection accuracyVSAvoiddesign flexibility
Core Design Contradiction:
Measurement precisionVSAdaptability or versatility

Solution Approach 1:

The patent segments conductive patterns into distinct high-voltage and low-voltage zones on different layers, isolating detection patterns from noise-generating high-voltage patterns to improve detection accuracy while maintaining overall design flexibility

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent resolves the conflict between isolation and flexibility by moving pattern separation into the vertical layer dimension, allowing horizontal design freedom while maintaining vertical isolation for accurate detection

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentEP4224654B1Power conversion device
Publication Date: 2025.11.19 DAIKIN INDUSTRIES LTD
  • EP4224654B1 patent drawingFigure 1
  • EP4224654B1 patent drawingFigure 2
  • EP4224654B1 patent drawingFigure 3

AI summary

A problem to be solved by the present disclosure is integration of an active filter circuit and an inverter circuit into one board. In a power conversion device (10), an active filter circuit (60) and an inverter circuit (40) are mounted on one printed wiring board (70), so that the power conversion device (10) can be reduced in size, weight, and cost.