Multi-Layer PCB Integration for Wireless Nodes
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Solution Overview
Problem
In wireless communication nodes, the large number of connectors required for connecting radio and antenna units in MIMO systems increases costs and assembly complexity, particularly in 4G and anticipated 5G systems, where numerous antenna elements and connectors are needed, leading to reliability issues and high material expenses.
Innovation Solution
Integrating antenna and radio parts into a single multi-layer Printed Circuit Board (PCB) within the communication node, eliminating the need for legacy connectors between filter, antenna, and radio units, and incorporating an isolator layer for radiation shielding, with surface-mounted filters and baseband components for efficient signal processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a large number of connectors are used to connect radio and antenna units in MIMO systems, then the system can support more antenna elements and radio branches, but the cost and assembly complexity increase significantly
Solution Approach 1:
The patent merges the radio unit and antenna unit into a single integrated structure where the radio PCB and antenna PCB are connected through a integrated circuit board. This consolidation eliminates the need for multiple external connectors (reducing from 2N connectors to internal traces), while still supporting N antenna elements and N radio branches through the integrated design. The filtering function is also integrated into the same structure, creating a unified system that maintains full MIMO functionality without the complexity of numerous discrete connectors.
2Ease of operation
If multiple connectors are used between filter unit, antenna unit, and radio unit, then signal transmission between these units is enabled, but the assembly difficulty and time increase considerably
Solution Approach 1:
The patent combines the filter unit, radio unit, and antenna unit into a single integrated assembly. The radio PCB and antenna PCB are mounted on the same integrated circuit board with filtering functions built-in, eliminating the need for separate connector assemblies. Signal transmission is achieved through internal PCB traces rather than external connectors, dramatically simplifying the assembly process while maintaining full signal transmission capability between all functional units.
3Adaptability or versatility
If legacy connectors are used to connect radio PCB and antenna PCB separately, then modular assembly is possible, but the overall device size and weight increase
Solution Approach 1:
The patent merges the radio PCB and antenna PCB into a single integrated circuit board structure, eliminating the physical space required for separate connector assemblies and jumper cables. The integrated design maintains modular functionality through internal routing and mounting structures, allowing the radio and antenna functions to coexist in a compact unified structure. This integration significantly reduces the overall device volume and weight compared to traditional separate-unit designs with external connectors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces the size and weight of communication nodes, simplifies assembly, enhances reliability, and significantly lowers connector costs and material expenses while improving yield rates and reducing environmental exposure risks.
Implementation Method 1
the PCB further comprises an isolator layer between the multiple radio layers and the at least one antenna layer
Data Source
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AI summary
The present invention relates to a multi-layer Printed Circuit Board, PCB, for a wireless communication node, comprising multiple radio layers (501, 601) comprising a surface layer at a first side of the PCB, wherein at least one radio component is to be mounted on the surface layer at the first side of the PCB; and at least one antenna layer (502, 602) comprising a surface layer at a second side of the PCB, wherein an antenna element is patched on the surface layer at the second side of the PCB.