Multilayer Printed Circuit Board Fabrication Using Nanomaterial Inks
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Solution Overview
Problem
Existing additive manufacturing processes for printed circuit boards (PCBs) are limited to few layers with high thickness, restricting flexibility and usability, particularly for wearable or implantable devices, and lack practicality in fabricating complex electronic components.
Innovation Solution
A multilayer printed circuit board (PCB) fabrication process using an ink-jet printer that prints conductive and insulation layers on flexible substrates, allowing for the creation of complex circuits with multiple layers separated by printed insulation, using conductive inks and materials like silver nanoparticles, and enabling the integration of various electronic components in a monolithic process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional additive manufacturing processes are used to fabricate PCBs, then conductive layers can be built up on base material, but the resulting PCBs are limited to few layers with high thickness which reduces flexibility and usability
Solution Approach 1:
The patent changes the physical parameters of the conductive material by using nanoscale materials (silver nanoparticles, carbon nanotubes, graphene) instead of traditional copper foil. This enables the conductive layers to be deposited as thin films with controlled thickness, achieving flexible, wearable-compatible PCBs while maintaining electrical conductivity. The nanomaterials allow for precise control of layer thickness and properties through solution concentration and deposition parameters.
Solution Approach 2:
The patent employs thin film deposition techniques to create flexible PCB structures. By using solution-based printing methods with nanomaterial inks, the conductive layers are formed as thin, flexible films that can conform to wearable and implantable device requirements, eliminating the rigid, thick structures of traditional PCB manufacturing.
2Device complexity
If additive manufacturing is used to create multilayer structures, then complex circuits can be fabricated, but the process becomes time-consuming and costly
Solution Approach 1:
The patent merges multiple manufacturing operations into a single additive printing process. Conductive layers, insulating layers, via formation, and component mounting are all integrated into one continuous printing operation, eliminating the need for separate etching, drilling, and lamination steps required by traditional PCB manufacturing. This consolidation dramatically reduces manufacturing time and cost while enabling complex multilayer circuits.
Solution Approach 2:
The additive printing process is self-service in that it directly deposits functional materials in their final configured state. The conductive ink is printed and cured to form conductive traces, and insulating material is printed to form dielectric layers, eliminating the need for separate processing steps. This direct-write approach simplifies the manufacturing workflow and reduces overall process complexity.
3Stability of the object's composition
If traditional PCB manufacturing methods are used, then rigid substrates provide structural stability, but they are not applicable to wearable or implantable devices
Solution Approach 1:
The patent replaces rigid PCB substrates with flexible, thin-film structures created through additive manufacturing. The solution-based deposition of nanomaterials on flexible substrates (such as polymer films or fabric) creates mechanically compliant circuits that can bend, stretch, and conform to the contours of wearable and implantable devices while maintaining electrical functionality.
Solution Approach 2:
The patent uses composite material systems combining nanoscale conductive materials (silver nanoparticles, carbon nanotubes, graphene) with flexible substrate materials and insulating polymers. These composite structures provide both the mechanical flexibility needed for wearable applications and the electrical conductivity required for functional circuits, achieving a balance between structural stability and adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of flexible, complex multilayer PCBs with reduced manufacturing costs, suitable for wearable or implantable devices, and facilitates the fabrication of active and passive electronic components, enhancing flexibility and usability while reducing production time and costs.
Implementation Method 1
a first conductive layer printed with conductive ink on the substrate... The first conductive layer may comprise at least one selected from the group consisting of silver nanoparticles, copper nanoparticles, gold nanoparticles
Implementation Method 2
The insulation layer may comprise two or more insulation material coatings printed on the first conductive layer and the substrate and may comprise at least one selected from the group consisting of: copper oxide nanoparticles, ceramic nanoparticles, pyrrole, polydimethylsiloxane (PDMS), polyimide
Data Source
AI summary
A multilayer printed circuit as well as printed passive and active electronic components using additive printing technology is provided. The fabrication process includes a substrate and a first conductive layer that is printed with conductive ink on the substrate. An insulation layer that has uniform thickness is printed on the first conductive layer and the substrate, less via cavities, test point cavities, and a surface mount component contact point and mounting cavities. The insulation layer is replaceable with resistive layer or semi-conductive layer to fabricate electronic components. The vias are printed with conductive ink inside of the via cavities. Additionally, a second conductive layer is printed on the vias and over the insulation layer. The insulation, resistive, or semi-conducting layer, the vias, and the conductive layers are repeatedly printed in sequence to thus form the multilayer printed circuit.