Multilayer PCB NFC Antenna Coil Layout for Longer Sensing Distance
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Solution Overview
Problem
Current NFC antenna modules in PaaK systems have short sensing distances, which are often insufficient for various applications.
Innovation Solution
A multilayer PCB design for NFC antenna modules with an NFC antenna coil wound around each PCB layer at the peripheral edge, extending between adjacent layers through vias, allowing for increased turns and alignment of coil segments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a traditional single-layer PCB design is used for NFC antenna module, then the device complexity is low, but the sensing distance is insufficient
Solution Approach 1:
The patent transitions from a traditional single-layer PCB design to a multilayer PCB structure, utilizing the vertical dimension (stacking direction) to increase the number of coil turns. The NFC antenna coil is wound around multiple PCB layers (e.g., 4 layers) and connects between layers through vias, effectively increasing the sensing distance without significantly increasing the planar footprint.
2Length of stationary object
If the NFC antenna coil is wound around peripheral edge of each PCB layer in a multilayer structure, then the sensing distance is enhanced, but the manufacturing precision requirements increase
Solution Approach 1:
The NFC antenna coil is segmented across multiple PCB layers, with each layer containing a portion of the coil winding. The coil is divided into multiple segments that are connected through vias between layers. This segmentation allows for more flexible manufacturing and alignment tolerances compared to a single continuous winding.
Solution Approach 2:
The NFC antenna coil is nested around the peripheral edges of multiple PCB layers in a stacked configuration. Each layer's coil segment is positioned at the periphery, and the segments are connected through vias, creating a nested multi-layer structure that maximizes the use of vertical space while maintaining manufacturing feasibility.
3Length of stationary object
If the total number of PCB layers is increased to more than two, then the sensing distance is improved, but the device complexity increases
Solution Approach 1:
The patent utilizes the vertical dimension by stacking multiple PCB layers (e.g., 4 layers) to increase the number of coil turns and enhance sensing distance. The multilayer structure is connected through vias that extend between layers, creating a three-dimensional coil configuration that improves performance without requiring a larger planar area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances sensing distance and operational characteristics such as Q factor and size, enabling effective communication between vehicles and mobile devices.
Implementation Method 1
NFC antenna modules used in current PaaK systems include an NFC antenna coil on a printed circuit board
Data Source
AI summary
A system is provided for secure communication between a vehicle and a portable communication device. The system includes a PaaK transceiver module having an NFC antenna module with a multilayer PCB. The multilayer PCB includes a plurality of PCB layers arranged in a stacking direction. The NFC antenna module also includes an NFC antenna coil. On each respective PCB layer, the NFC antenna coil is wound around the respective PCB layer at or near a peripheral edge of the respective layer. Each winding entirely around the PCB layer forms a turn. The NFC antenna coil extends between adjacent PCB layers of the multilayer PCB through at least one via, and a total number of PCB layers is greater than two.