Multilayer PCB Transmission Line Routing for 5G Signal Loss
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Solution Overview
Problem
The increasing complexity of antenna modules in 5G communication systems leads to higher signal loss in transmission lines, which reduces transmission power and necessitates a larger number of base stations, making the system less efficient and more costly.
Innovation Solution
A multilayer printed circuit board with a transmission line that connects substrate layers and includes sub-transmission lines between adjacent layers, reducing signal loss by minimizing the width and length of the transmission line and utilizing ground layers to minimize signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the transmission line length is increased to connect antenna modules in complex 5G systems, then the system complexity and coverage are improved, but signal loss increases
Solution Approach 1:
The patent transitions the transmission line from a two-dimensional planar layout to a three-dimensional structure by routing it through multiple substrate layers. The transmission line passes through first, second, and third substrate layers at different positions, utilizing the vertical dimension to reduce the horizontal transmission distance and associated signal loss while maintaining system complexity.
Solution Approach 2:
The transmission line is divided into multiple segments located in different substrate layers. Each segment connects specific antenna modules to circuit elements, allowing optimized routing through intermediate layers rather than requiring long continuous paths on single layers, thereby reducing overall signal loss.
2Area of stationary object
If more base stations are deployed to compensate for signal loss, then coverage is improved, but system cost and complexity increase
Solution Approach 1:
The patent changes the physical parameters of the transmission line system by routing through multiple substrate layers, which reduces signal attenuation. This parameter optimization allows existing base stations to maintain effective coverage over larger areas without requiring additional infrastructure, thereby avoiding increased system complexity.
3Loss of energy
If the transmission line width is minimized to reduce signal loss, then signal transmission quality is improved, but manufacturing precision requirements increase
Solution Approach 1:
By utilizing the vertical dimension through multiple substrate layers, the patent reduces the required horizontal transmission line length. This allows for wider transmission lines to be used in the horizontal plane, which are easier to manufacture with standard precision, while still achieving low signal loss through the shortened three-dimensional path.
Data Source
AI summary
A multilayer printed circuit board (PCB) including a plurality of substrate layers formed in stack is provided. The multilayer printed circuit board includes a first substrate layer located on an outer side of the plurality of substrate layers, and a second substrate layer located on another outer side of the plurality of substrate layers that is opposite to the first substrate layer. The multilayer printed circuit board further includes a transmission line, connecting a first point of the first substrate layer and a second point of the second substrate layer, which passes through the first and second substrate layers, and includes a sub-transmission line disposed between and extended along at least two adjacent substrate layers among the plurality of substrate layers.