Multilayer Planar Coil for Oval Shape Manufacturing

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Solution Overview

Problem

Existing coil manufacturing methods face challenges in producing coils of various shapes and sizes, particularly in forming oval coils, as it is difficult to wind copper sheets around oval rods and alter the geometrical shape of cured coils.

Innovation Solution

A coil design featuring a multilayer film with alternating electro-conductive and insulation layers, wound to form concentric loops, allowing for adjustable angles and widths, enabling the creation of coils with different shapes and thicknesses without requiring multiple elongated rods, and simplifying the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a copper sheet is wound around an oval elongated rod to form an oval coil, then the coil can be used for wireless charging and communication functions, but it is difficult to precisely wind the copper sheet and change the geometrical shape after curing

Engineering Contradiction:
Improvecoil shape varietyVSAvoidwinding difficulty
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent divides the coil structure into multiple segments or layers. Instead of winding a single thick copper sheet, the invention uses multiple thinner copper sheets stacked and wound together, which simplifies the winding process while enabling various coil shapes including oval configurations.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a single-plane winding approach to a multi-layer stacked winding approach. By stacking multiple copper sheets in the thickness direction and winding them together, the invention enables complex geometrical shapes while maintaining ease of manufacture, as each layer can be independently positioned and shaped.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If a thick copper sheet is used to create a coil with substantial thickness, then the coil can provide robust electromagnetic performance, but the manufacturing process becomes more difficult and less flexible

Engineering Contradiction:
Improvecoil thicknessVSAvoidmanufacturing simplicity
Core Design Contradiction:
Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent segments the thick coil structure into multiple thinner copper sheet layers. Each layer is easier to manufacture and handle individually, yet when stacked and wound together, they collectively achieve the desired substantial thickness for robust electromagnetic performance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent creates a composite coil structure by stacking multiple copper sheets with insulating materials between them. This composite approach achieves the functional equivalence of a thick copper coil while simplifying manufacturing, as each component layer is easier to produce and assemble than a single thick sheet.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS20230035952A1Coil, planar coil and method for making coil
Publication Date: 2023.02.02 3M INNOVATIVE PROPERTIES CO
  • US20230035952A1 patent drawing
  • US20230035952A1 patent drawing
  • US20230035952A1 patent drawing

AI summary

The disclosure relates to a coil, a planar coil, and a method for making a coil. Specifically, according to an embodiment of the disclosure, a coil includes: main coil surfaces which are opposite each other and are substantially planar; and a multilayer film which is wound to form a plurality of loops which are substantially concentric, and the plurality of loops include an innermost loop including a first longitudinal direction end of the coil, and an outermost loop including a second longitudinal direction end of the coil, and the multilayer film includes a plurality of first electro-conductive layers which alternate with each other, and one or more second electrical insulation layer.