Multilayer Plasma Polymer Coating for Electrical Assembly Protection
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Solution Overview
Problem
Conformal coatings like parylene offer excellent chemical, electrical, and physical protection but are costly, energy-intensive, and have low growth rates, making them inefficient for widespread use, especially in rework and reflow processes.
Innovation Solution
A multilayer coating system achieved through plasma polymerization of a mixture of fluorohydrocarbons and specific compounds, with adjustable molar ratios, providing enhanced adhesion and robustness, including multiple layers for improved performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If parylene conformal coating is used, then chemical, electrical and physical protection is improved, but manufacturing cost and energy consumption increase
Solution Approach 1:
The invention changes the chemical composition parameters by using fluorinated monomers (e.g., perfluorocyclobutene) instead of traditional parylene monomers, and adjusts processing parameters such as deposition temperature and pressure to achieve similar protective properties at lower cost and energy consumption
Solution Approach 2:
The invention employs readily available fluorinated monomers that can be purchased at lower cost compared to expensive parylene precursors, and the coating process uses standard equipment rather than specialized high-vacuum systems, reducing overall manufacturing cost
2Reliability
If parylene conformal coating is used, then protection quality is improved, but deposition time increases
Solution Approach 1:
The invention optimizes deposition parameters including temperature, pressure, and monomer flow rate to achieve higher deposition rates while maintaining coating quality, reducing the time required to achieve protective thickness
3Reliability
If parylene conformal coating is used, then protection quality is improved, but thermal energy consumption increases
Solution Approach 1:
The invention lowers the deposition temperature by using fluorinated monomers that polymerize effectively at reduced temperatures compared to parylene precursors, significantly reducing thermal energy consumption during the coating process
4Reliability
If multilayer coating with fluorohydrocarbon and compound (I) is used, then adhesion and robustness are improved, but coating complexity increases
Solution Approach 1:
The invention divides the coating into multiple functional layers: a fluorinated polymer layer providing chemical resistance and a crosslinked polymer layer providing mechanical strength and adhesion, with each layer optimized for specific protective functions
Solution Approach 2:
The invention creates a composite coating structure combining fluorinated polymers with crosslinked polymers formed from compounds of formula (I), leveraging the complementary properties of each material to achieve superior overall performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multilayer coating system offers robust protection comparable to parylene, withstands solvents and thermal ramps, and is more cost-effective and efficient, demonstrating improved durability and reliability in rework and reflow processes.
Implementation Method 1
plasma polymerization of a compound of formula (I) and a fluorohydrocarbon, wherein the molar ratio of the compound of formula (I) to the fluorohydrocarbon is from 5:95 to 50:50, and deposition of the resulting polymer onto at least one surface of the electrical assembly
Data Source
AI summary
The present invention relates to an electrical assembly which has a conformal coating, wherein said conformal coating is obtainable by a method which comprises: (a) plasma polymerization of a compound of formula (I) and a fluorohydrocarbon, wherein the molar ratio of the compound of formula (I) to the fluorohydrocarbon is from 5:95 to 50:50, and deposition of the resulting polymer onto at least one surface of the electrical assembly: wherein: R1 represents C1-C3 alkyl or C2-C3 alkenyl; R2 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R3 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R4 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R5 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; and R6 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl, and (b) plasma polymerization of a compound of formula (I) and deposition of the resulting polymer onto the polymer formed in step (a).