Multilayer Structure With Plastic Protrusions

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Solution Overview

Problem

Existing multilayer structures in electronics face challenges with increased complexity, manufacturing time, cost, size, and weight due to the integration of multiple elements, which complicates the manufacturing process and reduces integration levels.

Innovation Solution

A method involving a substrate film with conductive traces and electronic components, where a non-through cut facilitates the penetration of molten plastic to create protrusions on the opposite side, embedding components and traces within the plastic layer, allowing for efficient molding and functional protrusions without additional manufacturing steps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple dedicated elements are added to provide different functionalities (optical, sensing, attachment), then the functional capabilities are improved, but the overall number of elements increases which tends to increase the complexity, time span and cost of the manufacturing process

Engineering Contradiction:
Improvefunctional capabilitiesVSAvoidmanufacturing process complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple dedicated elements (optical elements, sensing elements, attachment elements) into a single integrated substrate. The substrate is designed with multiple regions that collectively provide optical functionality, sensing capability, and attachment features, thereby reducing the total number of separate components and simplifying the manufacturing process while maintaining all required functional capabilities

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The substrate is designed as a multi-functional element that simultaneously serves as a structural support, optical interface, sensing platform, and attachment mechanism. By making the substrate universal and capable of performing multiple functions, the patent eliminates the need for separate dedicated elements for each function, thereby reducing manufacturing complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple dedicated elements are added to provide different functionalities, then the functional capabilities are improved, but the time span and cost of the manufacturing process increase

Engineering Contradiction:
Improvefunctional capabilitiesVSAvoidmanufacturing efficiency
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent merges multiple functional elements into a single substrate that can be manufactured as one integrated component. This consolidation allows for streamlined manufacturing processes, reduced assembly steps, and lower production costs while maintaining all required functional capabilities including optical, sensing, and attachment functions

Inventive Principle:
Principle #5Merging (Combining)

3Adaptability or versatility

If the integration level is reduced by adding more elements, then the functional capabilities are improved, but the size and weight of the overall structure increase

Engineering Contradiction:
Improvefunctional capabilitiesVSAvoidstructure weight
Core Design Contradiction:
Adaptability or versatilityVSWeight of moving object

Solution Approach 1:

The patent combines multiple functional elements into a single integrated substrate, thereby maintaining all required functional capabilities (optical, sensing, attachment) while minimizing the overall size and weight of the structure. The integrated design eliminates redundant materials and structural support requirements that would be necessary if separate elements were used

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the production of compact, durable, and functional multilayer structures with varied functionalities, such as optical and sensing functions, while simplifying the manufacturing process and reducing the need for specialized equipment, allowing for efficient production of complex products with integrated electronics.

Implementation Method 1

the pressure of the plastic establishes a through-hole from the non-through cut

Methodology Applied
Scientific EffectPressure-driven flow: Pressure Gradient

Data Source

PatentEP3370938B1Multilayer structure and related method of manufacturing
Publication Date: 2020.05.27 TACTOTEK
  • EP3370938B1 patent drawingFigure 1~3
  • EP3370938B1 patent drawingFigure 4

AI summary

A multilayer structure (200) comprising a preferably flexible substrate film (102) capable of accommodating electronics (106, 108), such as conductive traces and optionally electronic components such as SMDs (surface mount device), on a first side thereof, said film having the first side and a second side, and a plastic layer (204) molded onto the first side of the substrate and protruding at one or more locations (114, 114B) through the substrate onto the second side, forming one or more protrusions (218) on the second side having a predetermined function.A corresponding method of manufacture is presented.