Multilayer Polymer Sheet with Laser-Activated Conductive Patterns
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Solution Overview
Problem
There is a need for electronic components that can perform multiple functions in reduced size, as space for installation becomes limited, and existing thermoplastic-based solutions struggle to integrate multiple circuit paths efficiently.
Innovation Solution
A multilayer sheet manufacturing process involving a first polymer layer with an inner electrically conductive pattern and a second polymer layer with a laser direct structure additive, where the second polymer has a lower glass transition temperature, allowing for thermal lamination and the creation of additional conductive patterns on the outer surface through laser activation and metal application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple circuit paths are integrated into a single thermoplastic component, then the number of functions increases and size is reduced, but the manufacturing complexity and difficulty of integrating multiple conductive patterns increases
Solution Approach 1:
The patent divides the single component into multiple polymer layers, each containing its own conductive pattern. The first polymer layer contains a first conductive pattern formed by laser direct structuring, while the second polymer layer contains a second conductive pattern. This segmentation allows each layer to be manufactured and patterned independently, then bonded together, thereby integrating multiple functions while managing manufacturing complexity through modular construction.
Solution Approach 2:
The patent transitions from planar integration of circuit paths to three-dimensional multilayer construction. By stacking multiple polymer layers with conductive patterns on different planes and bonding them together, the system achieves multiple circuit paths and functions within a compact vertical footprint, effectively using the third dimension to reduce overall size while maintaining manufacturing feasibility.
2Volume of moving object
If multiple circuit paths are integrated into a single thermoplastic component, then space utilization improves and size is reduced, but the difficulty of forming multiple conductive patterns increases
Solution Approach 1:
The patent segments the conductive pattern formation process across multiple polymer layers. Each layer is independently patterned with conductive tracks using laser direct structuring before assembly. This approach allows complex multilayer circuit integration while keeping the pattern formation process manageable by working with simpler single-layer patterns that are then stacked and bonded together.
Solution Approach 2:
The patent performs laser direct structuring to form conductive patterns on each polymer layer before the layers are bonded together. This preliminary action allows each layer to be prepared independently with its specific conductive pattern, and then the layers are assembled in a predetermined configuration. This pre-patterning approach simplifies the overall manufacturing process compared to attempting to form all conductive patterns simultaneously in a single complex step.
3Ease of manufacture
If polymer layers with different glass transition temperatures are used, then thermal lamination becomes feasible, but material selection constraints increase
Solution Approach 1:
The patent specifies that the first polymer has a glass transition temperature of at least 100°C and the second polymer has a glass transition temperature of less than 100°C. This parameter differentiation enables thermal lamination where the second layer can be bonded to the first by heating above its Tg but below the first layer's Tg, allowing controlled assembly. While this creates a constraint on material selection, it provides a clear manufacturing pathway for multilayer construction with predictable thermal behavior.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process enables the integration of multiple circuit paths into a single component, offering flexible design options for electronic devices and allowing for the manufacture of multilayer sheets with structural integrity and reduced size, suitable for various electronic applications.
Implementation Method 1
forming an activated surface pattern by activating a portion of the laser direct structure additive on the outer surface of the second polymer layer with a laser machine
Implementation Method 2
pressing the first polymer layer and the second polymer composition together to laminate a second polymer layer
Data Source
Figure 1~2
Figure 3A~3D
Figure 4~5
AI summary
A process of manufacturing a multilayer sheet having electrically conductive patterns comprises feeding a first polymer layer and a second polymer composition to a calendering stack, the first polymer layer having an inner electrically conductive pattern disposed thereon, the first polymer layer comprising a first polymer composition, which contains a first polymer having a first glass transition temperature, and the second polymer composition comprising a second polymer and a laser direct structure additive (LDS), the second polymer having a second glass transition temperature that is 50 to 100 °C lower than the first glass transition temperature; pressing the first polymer layer and the second polymer composition together to laminate a second polymer layer which comprises the second polymer composition to the first polymer layer, the second polymer layer having an inner surface facing the inner electrically conductive pattern of the first polymer layer and an opposing outer surface; forming an activated surface pattern on the outer surface of the second polymer layer; and applying a conductive metal on the activated surface pattern, wherein the first polymer layer is in direct physical contact with the second polymer layer.