Multilayer Power Module With Embedded Decoupling and Partial Cooling
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Solution Overview
Problem
In power applications, especially those using wide band gap devices, parasitic elements caused by packaging and assembly techniques lead to increased switching losses, electromagnetic emissions, and poor current distribution in parallel-connected power modules.
Innovation Solution
The power module incorporates an inductor embedded in a multilayer structure, with optional magnetic materials and a liquid-cooled busbar system, where only part of the multilayer structure is cooled by a liquid-cooled system, reducing parasitic components and enhancing power density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional packaging and assembly techniques are used, then manufacturing is easier, but parasitic elements increase leading to higher switching losses and electromagnetic emissions
Solution Approach 1:
The patent merges multiple functions into the multilayer structure: power die embedding, inductor integration, capacitor placement, and liquid cooling channels are all combined into a single integrated package. This eliminates the need for separate packaging components and reduces parasitic elements by minimizing connection paths between components.
Solution Approach 2:
The patent embeds power dies within the multilayer structure, places capacitors inside holes of assembled sub-modules, and integrates cooling channels within the same structure. This nested arrangement reduces the overall footprint and minimizes parasitic inductance by placing components as close as possible to each other.
2Power
If more components are added to increase power density, then power density increases, but parasitic components and electromagnetic emissions increase
Solution Approach 1:
The patent applies local quality by providing liquid cooling only to specific high-heat-generation areas (power die regions) rather than the entire module. The multilayer structure also provides localized electromagnetic shielding around high-frequency switching components, reducing emissions without affecting the entire module.
Solution Approach 2:
The patent transitions from planar component arrangement to three-dimensional multilayer embedding. Power dies, capacitors, and inductors are distributed across multiple layers and depths, reducing parasitic inductance by shortening current paths and minimizing loop areas, thereby reducing electromagnetic emissions while increasing power density.
3Temperature
If a liquid cooled system cools the entire multilayer structure, then thermal management is improved, but device complexity and cost increase
Solution Approach 1:
The patent applies partial cooling by providing liquid cooling only to the power die regions that generate the most heat, rather than cooling the entire multilayer structure. This selective approach achieves effective thermal management of critical components while reducing the complexity and cost of the cooling system.
4Power
If multiple sub-modules are assembled, then power capacity increases, but parasitic inductance and manufacturing complexity increase
Solution Approach 1:
The patent divides the power module into multiple sub-modules, each with its own multilayer structure containing power dies, capacitors, and cooling channels. This segmentation allows independent manufacturing and assembly of standardized units, reducing overall manufacturing complexity while enabling scalable power capacity. The consistent multilayer design across sub-modules simplifies assembly tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces power losses and electromagnetic emissions, increases power density, and allows for a compact, cost-effective power module design with improved current distribution.
Implementation Method 1
a liquid cooled busbar composed of two bars 20a and 20b... The bar 20a is used to convey a negative DC power to the dies of the power module and the bar 20b is used to convey a positive DC power to the dies of the power module
Implementation Method 2
liquid cooled system... only a part of the multilayer structure comprising the at least one power die is cooled by a liquid cooled system
Implementation Method 3
an inductor embedded in the multilayer structure... Each power module comprises a gate driver 15 that provides gate signals to the power dies D1 and D2... The source of the power die D1 is connected to the drain of the power die D2 and to a first terminal of an inductor L1
Implementation Method 4
lamination isolation and conducting layers on the base layer, drilling and metallizating in order to connect the at least one power die to the conducting layers
Data Source
Figure 1~2
Figure 3
Figure 4a~4e
AI summary
The present invention concerns a power module comprising at least one power die, the at least one power die is embedded in a multilayer structure, the multilayer structure is an assembly of at least two sub-modules, each sub-module being formed of isolation and conductor layers and the power module further comprises at least one capacitor embedded in the multilayer structure for decoupling an electric power supply to the at least one power die embedded in the multilayer structure and at least one driving circuit of the at least one power die that is disposed on a surface of the multilayer structure or embedded completly or partially in the multilayer structure.