Multilayer Power Module with Pin Fin Cooling for Low Inductance

The patent segments the power module into multiple independent layers (first power layer, second power layer, control layer) with separate substrate structures. This segmentation allows independent thermal management for each layer, enabling higher power density in specific layers without uniformly increasing temperature across the entire module, thus resolving the contradiction between power density and heat generation.

The patent transitions from a conventional planar single-layer structure to a three-dimensional multilayer stacked architecture. By adding the vertical dimension with multiple stacked power layers and control layers, the module achieves higher power density without proportionally increasing heat generation in any single plane, as heat is distributed across multiple layers with independent thermal pathways.

The patent merges the power handling functions and control functions into a single integrated multilayer module structure. The power layers and control layer are stacked and electrically connected within one module, reducing the external loop area and inductance. This integration achieves low inductance and reduced switching losses without requiring multiple separate components, thus avoiding excessive device complexity.

The multilayer substrate structure serves multiple functions simultaneously: it provides electrical connections, thermal management pathways, mechanical support, and electromagnetic shielding. This multi-functionality reduces the need for additional separate components, achieving low inductance and reduced switching losses without proportionally increasing device complexity.