Multilayer Electronic Component Printing With UV-Cured Layer Separation
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Solution Overview
Problem
Conventional methods for manufacturing multilayer ceramic capacitors, such as screen-printing and gravure printing, face challenges including defects, low process efficiency, and limitations in reducing dielectric and internal electrode thickness due to issues with pattern mixing and the use of consumables like PET films, which affect the stability and quality of the components.
Innovation Solution
A method involving inkjet printing techniques to form dielectric, internal, and external electrode patterns using ceramic and metal inks with photocurable resins, followed by ultraviolet curing and sintering, to improve interface stability and reduce defect rates by ensuring precise layer formation and efficient processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If screen-printing or gravure printing technique is used, then manufacturing process can be established, but defects such as cracks occur and process efficiency is low due to pattern mixing and consumption of PET films
Solution Approach 1:
The patent replaces conventional screen-printing or gravure printing techniques with inkjet printing technology. This substitution eliminates the need for PET films and other consumables, prevents pattern mixing between layers, and enables precise deposition of dielectric and electrode patterns without cracks or defects, thereby improving both reliability and process efficiency
Solution Approach 2:
The patent changes the printing method from contact-based screen/gravure printing to non-contact inkjet printing. This parameter change allows for precise control of material deposition, eliminates mechanical contact that causes cracks, and enables sequential layer formation without pattern mixing, resolving the contradiction between defect reduction and efficiency improvement
2Manufacturing precision
If conventional printing techniques are used, then manufacturing can proceed, but thickness of dielectric layers and internal electrodes cannot be reduced due to pattern mixing issues
Solution Approach 1:
The patent replaces conventional printing with inkjet printing technology that enables precise control of layer thickness. The inkjet system deposits materials layer by layer with exact positioning, preventing pattern mixing and ensuring stable interfaces between dielectric layers and electrodes, thereby achieving both thin thickness and high reliability
Solution Approach 2:
The patent segments the manufacturing process into distinct sequential steps: forming dielectric patterns, forming internal electrode patterns, and forming external electrode patterns using inkjet printing. This segmentation prevents pattern mixing and allows each layer to be formed with precise thickness control, ensuring interface stability while enabling reduced thickness
3Productivity
If inkjet printing technique is used to form patterns, then process efficiency improves, but patterns may mix with each other causing shape defects
Solution Approach 1:
The patent applies preliminary curing action between pattern formation steps. After depositing each layer (dielectric or electrode pattern) using inkjet printing, the layer is cured before the next layer is formed. This preliminary curing prevents pattern mixing while maintaining the efficiency benefits of inkjet printing, as each layer is stabilized before subsequent deposition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances process efficiency and reduces defect rates by maintaining interface stability between dielectric and electrode patterns, enabling the production of multilayer electronic components with improved capacitance and reduced thickness, addressing the limitations of traditional methods.
Implementation Method 1
a second operation of obtaining a cured layer pattern by irradiating the layer pattern with ultraviolet light to cure the layer pattern
Implementation Method 2
a sintering operation of obtaining the multilayer electronic component by sintering the laminate
Data Source
AI summary
A method of manufacturing a multilayer electronic component including: a first operation of obtaining a layer pattern constituting one layer by performing at least one of a process of forming a dielectric pattern by ejecting a ceramic ink containing a dielectric material and a photocurable resin, a process of forming an internal electrode pattern by ejecting a first metal ink containing conductive particles for internal electrodes and a photocurable resin, and a process of forming external electrode patterns by ejecting a second metal ink containing conductive particles for external electrodes and a photocurable resin; a second operation of obtaining a cured layer pattern by irradiating the layer pattern with ultraviolet light to cure the layer pattern; obtaining a laminate in which a plurality of cured layer patterns are stacked by carrying out a plurality of the first and second operations; and sintering the laminate.