Multilayer Probe Board Layout for Smaller Ultrasound Endoscope Tips
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Solution Overview
Problem
Existing ultrasound endoscopes face challenges in reducing the size and diameter of the distal end of the insertion portion to minimize patient burden, particularly in connecting cables to ultrasound transducers efficiently.
Innovation Solution
A multilayer board configuration is employed, comprising a front-side, intermediate, and back-side layers with ground terminals, signal line connecting terminal arrays, and wires with thermal conductivity, which are laminated to reduce the distal-end rigid length and facilitate efficient electrical connections to ultrasound transducers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a cable is connected in a shifted manner to a flexible board to reduce distal end diameter, then the insertion portion diameter is reduced, but the connection complexity and manufacturing difficulty increase
Solution Approach 1:
The board is divided into multiple layers (front-side layer, intermediate layer, back-side layer) with each layer serving specific functions. The signal lines are segmented and routed through different layers, with the intermediate layer providing a shifted connection path that reduces the distal end diameter while maintaining manufacturing feasibility through standardized lamination processes.
Solution Approach 2:
The connection structure transitions from a two-dimensional planar connection to a three-dimensional multi-layer configuration. By utilizing the thickness dimension (z-axis) with multiple laminated layers, the patent achieves shifted connections that reduce the distal end diameter without complicating the manufacturing process, as multi-layer lamination is a standard PCB fabrication technique.
2Volume of moving object
If multiple shield lines and signal lines are connected to reduce insertion portion size, then the distal end diameter is reduced, but the thermal management and signal transmission efficiency may deteriorate
Solution Approach 1:
Different regions of the multilayer board are assigned different functions: the front-side layer and back-side layer contain signal line connecting terminals for electrical connections, while the intermediate layer contains wires with high thermal conductivity specifically for heat dissipation. This local specialization allows efficient thermal management in a compact structure by concentrating thermal management resources where needed without compromising signal transmission.
Solution Approach 2:
The patent employs a composite multilayer structure combining different material properties in each layer. The intermediate layer uses materials with high thermal conductivity (such as metal traces or thermally conductive substrates) to dissipate heat, while the front-side and back-side layers use standard PCB materials for electrical connections. This composite approach enables simultaneous optimization of thermal management and signal transmission in a reduced-size configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multilayer board design effectively reduces the size of the distal end of the insertion portion, enhancing patient comfort by minimizing the insertion diameter while maintaining efficient signal transmission and thermal management.
Implementation Method 1
a wire having a thermal conductivity, the wire extending to the second end on the intermediate layer
Data Source
AI summary
A multilayer board includes: a front-side layer; an intermediate layer; a back-side layer; the front-side layer; a first ground terminal and a second ground terminal for connecting ground lines of a plurality of shield lines to be connected to the multilayer board; a plurality of signal line connecting terminal arrays each including a plurality of signal line connecting terminals for connecting respective signal lines of the shield lines; and a wire having a thermal conductivity, the wire extending to the second end on the intermediate layer.