Multi-Layer Probe Structure for Controlled Bending and Low-Force Contact
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry requires improved probe designs for contacting electronic components that can withstand increased complexity and miniaturization, necessitating probes with smaller sizes, lower contact force, and higher current carrying capacity while avoiding damage from shorts in failed devices.
Innovation Solution
Multi-layer elongated probes with a preferential bending axis perpendicular to the plane of the probe layers, formed from at least three layers with distinct materials, and a compliant region that bends when subjected to compressive force, allowing for controlled deflection and enhanced mechanical and electrical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If probe size is reduced to accommodate miniaturized semiconductor devices, then contact capability with small devices is improved, but mechanical strength and durability deteriorate
Solution Approach 1:
The probe employs a multi-layer composite structure with alternating high-stiffness and low-stiffness layers. The high-stiffness layers (e.g., metal layers) provide mechanical strength and structural integrity, while the low-stiffness layers (e.g., polymer or sacrificial material layers) enable controlled bending and compliance. This composite architecture allows the probe to maintain adequate mechanical strength despite reduced overall size, resolving the contradiction between miniaturization and strength preservation.
2Object-affected harmful factors
If contact force is reduced to prevent damage to small devices, then device safety is improved, but signal quality and reliability deteriorate
Solution Approach 1:
The probe utilizes controlled elastic deformation by adjusting the thickness and material properties of the low-stiffness layers. When the probe contacts the device, these layers bend elastically to reduce peak contact forces, preventing device damage. The high-stiffness layers ensure that sufficient force is transmitted for reliable electrical contact and signal quality. This parameter optimization resolves the contradiction between reducing contact force for safety and maintaining force for signal quality.
3Volume of moving object
If probe thickness is reduced to achieve smaller size, then miniaturization is improved, but current carrying capacity deteriorates
Solution Approach 1:
The multi-layer composite structure concentrates conductive high-stiffness material layers along the probe's current transmission path while maintaining thin overall thickness through the use of thin low-stiffness spacer layers. This allows adequate current carrying capacity through the conductive layers while the composite structure maintains the required thin profile for miniaturized applications, resolving the contradiction between thickness reduction and current capacity maintenance.
4Stability of the object's composition
If probe stiffness is increased to improve structural integrity, then mechanical stability is improved, but adaptability to varying contact conditions deteriorates
Solution Approach 1:
Different regions of the probe have different stiffness characteristics through the multi-layer construction. The high-stiffness layers provide structural integrity and stability along the probe body, while the low-stiffness layers are strategically positioned to provide local compliance and adaptability at the contact region. This spatial variation in stiffness properties resolves the contradiction between overall structural integrity and local contact adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The probes provide reliable electrical connections with controlled bending and increased durability, enabling effective testing and contact with semiconductor devices without causing damage, while maintaining high current carrying capacity.
Implementation Method 1
an intermediate region comprising at least one elastically compliant region wherein the intermediate region connects the tip end to the base end
Implementation Method 2
the intermediate region is formed from at least three layers and at least two distinct materials wherein for a plurality of pairs of adjacent layers, each pair includes a first adjacent layer and a second adjacent layer wherein a material on one of the first and second adjacent layers is different from a material on the other of the first and second adjacent layers
Data Source
AI summary
Embodiments are directed to probes formed from multiple layers with at least a portion of the layers including portions that include elastic compliant regions of the probes wherein such elastic portions of different layers are formed of different materials and wherein a plane of preferred elastic deformation of the probes is parallel to a plane containing (1) a normal to the planes of the layers and (2) a longitudinal axes of the probes or a local longitudinal axes of the probes.