Multilayer Resin Substrate with Differential Aperture Ground Conductor
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Solution Overview
Problem
Multilayer resin substrates are prone to deformation and distortion due to expansion and contraction, and delamination caused by gas pressure in the insulating resin base material layers during heating.
Innovation Solution
The multilayer resin substrates and electronic components incorporate a planar conductor with a frame or planar shape, featuring a plurality of openings with a higher aperture ratio in the inner peripheral portion and a lower aperture ratio in the outer peripheral portion, allowing for controlled gas escape and reduced stress unevenness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If gas vent holes are provided near outer end or end portion of multilayer resin substrate, then gas discharge efficiency is improved, but stress unevenness at interface increases causing deformation
Solution Approach 1:
The patent applies local quality by differentiating the opening aperture ratios in different regions of the planar conductor. The inner peripheral portion has a first aperture ratio while the outer peripheral portion has a second aperture ratio that is smaller than the first. This local differentiation allows gas to be discharged effectively from the inner region while the outer region maintains structural integrity to prevent deformation at the substrate edges.
2Reliability
If conductor pattern is metal foil with high thermal expansion coefficient, then electrical conductivity is improved, but thermal expansion causes substrate deformation
Solution Approach 1:
The patent introduces a porous structure into the planar conductor by providing multiple openings with different aperture ratios in different regions. This porous design allows the conductor to accommodate thermal expansion of metal foil while maintaining electrical conductivity, as the openings provide space for expansion and reduce the overall thermal stress transmitted to the substrate.
3Reliability
If insulating resin base material layers are stacked to form multilayer structure, then electrical insulation is improved, but differential expansion causes warping and twisting
Solution Approach 1:
The patent applies local quality by creating regional differences in the planar conductor's opening aperture ratios. The inner peripheral portion with larger aperture ratio accommodates expansion from underlying insulating layers, while the outer peripheral portion with smaller aperture ratio maintains structural stability, thereby preventing warping and twisting of the multilayer substrate.
4Object-generated harmful factors
If openings are uniformly distributed in planar conductor, then gas discharge is improved, but stress distribution becomes uneven
Solution Approach 1:
The patent implements local quality by establishing different aperture ratios for openings in different regions of the planar conductor. The inner peripheral portion has a first aperture ratio optimized for gas discharge, while the outer peripheral portion has a second aperture ratio optimized for stress distribution. This regional differentiation ensures both effective gas discharge and uniform stress distribution across the conductor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces or prevents deformation, distortion, delamination, and gas-related failures in multilayer resin substrates and electronic components by managing thermal expansion and gas pressure effectively.
Implementation Method 1
the plurality of openings include a first opening group in which a plurality of openings are arranged at regular intervals, and a second opening group in which a plurality of openings located closer to an outer end of the planar conductor than the first opening group are arranged at regular intervals
Implementation Method 2
the conductor pattern and the insulating resin base material layers during the heating behave differently, which causes the multilayer substrate to be easily deformed. For example, in a case in which the conductor pattern is metal foil, such as copper foil, the conductor pattern expands and contracts according to a linear expansion coefficient
Data Source
AI summary
A multilayer resin substrate includes insulating resin base material layers, and conductor patterns on at least one of the insulating resin base material layers. The conductor patterns include a ground conductor on a main surface of the insulating resin base material layers and extend into a frame shape or a planar shape, and the ground conductor includes openings. An aperture ratio of the openings in an outer peripheral portion of the ground conductor is less than an aperture ratio of the openings in an inner peripheral portion of the ground conductor.