Multilayer Resin Substrate With Thin Portions For Flexibility
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer resin substrates used for high-frequency signal transmission often lack flexibility and can deviate from desired impedance due to variations in the positional relationship between holes in the porous sheet and conductors, leading to degradation of electrical characteristics and radiation noise.
Innovation Solution
A multilayer resin substrate design featuring overlapping and non-overlapping conductor patterns with a thin portion between signal lines, where the thin portion is created by recesses that reduce thickness and avoid overlapping areas, enhancing flexibility and maintaining electrical characteristics by minimizing impedance variations and radiation noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the multilayer resin substrate includes an overlapping portion where signal line and conductor pattern overlap in the laminating direction, then the electrical characteristics are maintained, but the flexibility is reduced
Solution Approach 1:
The invention applies local quality by creating a thin portion with reduced thickness specifically in the non-overlapping area between the signal line and conductor pattern. This localized thickness reduction increases flexibility only where electrical characteristics are less sensitive, while maintaining the standard thickness in overlapping portions where impedance control is critical. The thin portion is positioned at a location where it does not interfere with the overlapping conductor patterns, thus resolving the contradiction between flexibility and electrical characteristic maintenance.
2Reliability
If holes are formed in the porous sheet to reduce dielectric constant and thickness, then the insulating performance is improved, but the positional relationship variation causes impedance deviation
Solution Approach 1:
The invention extracts the hole-forming operation from the overlapping portion and relocates it to the non-overlapping portion. By removing holes from areas where conductor patterns overlap, the patent eliminates the source of impedance variation caused by positional misalignment. The holes are retained in the non-overlapping area where they provide insulating benefits without affecting the electrical characteristics of the signal transmission path.
Data Source
AI summary
A multilayer resin substrate includes resin substrates laminated together, an overlapping portion in which a signal line as a conductor pattern and another conductor pattern overlap each other in a laminating direction of the resin substrates, and a non-overlapping portion in which the signal line and the other conductor pattern do no overlap each other in the laminating direction. A thin portion is provided at a position in the non-overlapping portion near the overlapping portion. The thin portion is a portion of the multilayer resin substrate which has a thickness smaller than the thickness in the overlapping portion in the laminating direction of the resin substrates.