Multilayer RF Module Layout for Compact Multiband Amplification
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Solution Overview
Problem
The existing radio frequency modules designed for multiband technology face challenges in size reduction due to the increased number of power amplifiers required for different frequency bands, leading to a larger module size and potential interference that degrades the quality of radio frequency signals.
Innovation Solution
A radio frequency module configuration with power amplifiers and a control circuit split across two principal surfaces of a module board, where power amplifiers amplify signals in specific frequency bands and a control circuit manages them, reducing noise and size by optimizing the placement of components and using a module board with a multilayer structure for improved electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple power amplifiers are added to support multiband technology, then the frequency band coverage is improved, but the module size increases
Solution Approach 1:
The patent transitions from a single-plane layout to a three-dimensional stacked architecture, placing power amplifiers on different layers of the module board. This vertical arrangement allows multiple power amplifiers to coexist in a compact footprint, resolving the contradiction between supporting multiple frequency bands and maintaining small module size.
Solution Approach 2:
The module board is divided into multiple layers with power amplifiers segmented across different planes. This segmentation allows independent placement and routing of each power amplifier, enabling multiband support while optimizing space utilization and reducing interference between different frequency band components.
2Adaptability or versatility
If multiple power amplifiers are added to support multiband technology, then the frequency band coverage is improved, but signal interference increases
Solution Approach 1:
By separating power amplifiers onto different vertical layers, the patent increases the physical distance between potential interference sources while maintaining a compact horizontal footprint. This spatial separation in the vertical dimension reduces electromagnetic coupling and signal interference between multiband power amplifiers.
Solution Approach 2:
The module board structure serves as an intermediary with built-in shielding and isolation mechanisms between different power amplifier layers. This intermediary structure manages electromagnetic fields and prevents harmful interactions, allowing multiple frequency bands to operate simultaneously without degradation.
3Volume of moving object
If power amplifiers are placed close together for miniaturization, then the module size is reduced, but noise and interference increase
Solution Approach 1:
The patent resolves the noise-interference problem by moving the separation strategy from the horizontal plane to the vertical dimension. Power amplifiers are positioned close together horizontally for miniaturization but separated vertically through multiple layers, maintaining compact size while reducing electromagnetic interference through increased vertical spacing and shielding.
Data Source
AI summary
A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a first power amplifier disposed on the first principal surface and configured to amplify a transmission signal in a first frequency band; a second power amplifier disposed on the first principal surface and configured to amplify a transmission signal in a second frequency band different from the first frequency band; and a power amplifier (PA) control circuit disposed on the second principal surface and configured to control the first power amplifier and the second power amplifier.