Multilayer Circuit Module Shielding for Compact RF Isolation
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Solution Overview
Problem
Existing semiconductor packages face challenges in downsizing due to increased circuit area caused by the installation of many passive and active components on printed wiring boards, leading to issues with electromagnetic interference and isolation between components.
Innovation Solution
A circuit module is designed with a multilayer board featuring first and second through-holes, where high-frequency components are placed in the first through-holes and surrounded by shield parts composed of conductors. This configuration provides effective electromagnetic shielding and reduces the circuit's area by utilizing a three-dimensional layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple passive and active components are installed on printed wiring boards, then the circuit functionality is enhanced, but the circuit area increases and electromagnetic interference occurs
Solution Approach 1:
The patent transitions from a two-dimensional surface mounting arrangement to a three-dimensional vertical stacking configuration. Multiple circuit boards are arranged in the vertical direction with corresponding through-holes aligned across layers, allowing components to be mounted both on board surfaces and within through-holes. This dimensional change enables enhanced circuit functionality while reducing the planar circuit area by utilizing vertical space.
2Adaptability or versatility
If multiple passive and active components are installed on printed wiring boards, then the circuit functionality is enhanced, but electromagnetic interference and isolation issues occur
Solution Approach 1:
The patent divides the electromagnetic shielding function into multiple discrete shield members positioned between adjacent circuit boards. Each shield member is inserted into corresponding through-holes of multiple boards, creating segmented shielding zones. This segmentation approach provides effective electromagnetic interference isolation between different circuit boards while maintaining the enhanced circuit functionality achieved through multi-board configuration.
3Ease of manufacture
If a conventional surface-mounted semiconductor package is used, then the packaging is simple, but the circuit area increases and downsizing is difficult
Solution Approach 1:
The patent employs a vertical stacking arrangement where multiple circuit boards and shield members are positioned in the vertical direction. This three-dimensional configuration allows the circuit module to achieve compactness in the planar area by utilizing vertical space, thereby enabling downsizing while maintaining manufacturing simplicity through standardized through-hole insertion and stacking processes.
4Object-affected harmful factors
If electromagnetic shields are provided by covering IC chips with metal plates, then electromagnetic interference is suppressed, but the device complexity and area increase
Solution Approach 1:
The patent utilizes thin film-shaped shield members that are inserted into through-holes of circuit boards. These thin film shields provide effective electromagnetic interference suppression between adjacent boards while maintaining a compact and simple overall structure. The thin film configuration reduces the complexity and space requirements compared to traditional bulk metal plate shields, enabling effective shielding with minimal added device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively suppresses the deterioration of isolation between components while achieving downsizing of the circuit module, enhancing electromagnetic shielding and reducing the overall area of the circuit.
Implementation Method 1
an electromagnetic shield is provided by covering the IC chip by a metal plate being an electric conductor
Data Source
AI summary
A circuit module includes: a multilayer board having a plurality of first through-holes each penetrating at least one layer thereof; a plurality of high frequency components disposed in the plurality of first through-holes, respectively; and a plurality of shield parts individually surrounding the plurality of high frequency components. The multilayer board has a second through-hole penetrating at least a layer in which each high frequency component is disposed. Each of the plurality of shield parts includes a first conductor, a second conductor, and a third conductor. The first conductor and the second conductor sandwich the high frequency component in a lamination direction of the multilayer board. The third conductor is disposed in the second through-hole.