Multilayer RF Module Layout for Input-Output Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In multiband communication devices, the increasing density of circuit elements and reduced size of radio-frequency modules lead to challenges in maintaining sufficient isolation between input and output terminals, causing deterioration in signal characteristics.
Innovation Solution
A radio-frequency module configuration with strategically positioned input and output switches and filters on a multilayer substrate, where terminals are disposed to maximize separation and utilize electromagnetic shielding, ensuring effective isolation through distinct terminal and wiring pattern arrangements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the radio-frequency module is reduced and circuit elements are increased in density, then the miniaturization and performance improvement are achieved, but the isolation between input terminal and output terminal deteriorates
Solution Approach 1:
The patent utilizes a multilayer substrate structure to arrange circuit elements in three-dimensional space. The input switch and output switch are placed on different layers (first wiring layer and second wiring layer respectively), with a ground layer sandwiched between them. This vertical dimensional separation effectively increases the isolation distance between input and output terminals while maintaining a compact planar footprint, thus resolving the contradiction between miniaturization and isolation maintenance.
Solution Approach 2:
The patent divides the radio-frequency module into distinct functional regions: a switch region containing the input and output switches, and a filter region containing the filter elements. This spatial segmentation isolates the input and output signal paths, preventing interference while allowing dense packing of circuit elements within each region. The ground layer further segments the electromagnetic fields between different layers.
2Adaptability or versatility
If more circuit elements are mounted on the radio-frequency module, then the functionality and performance are improved, but the isolation between input and output terminals deteriorates
Solution Approach 1:
By moving to a multilayer architecture, the patent can accommodate additional circuit elements (filters, matching elements, switches) on different layers without increasing the planar area. The input switch on the first wiring layer and output switch on the second wiring layer are separated vertically by a ground layer, maintaining isolation even as element count increases.
Solution Approach 2:
The patent embeds multiple functional elements within a compact structure. The ground layer is sandwiched between the first and second wiring layers, creating a nested configuration where the ground layer provides electromagnetic shielding while the signal layers carry different functions. This nesting allows high element density while maintaining isolation through the embedded ground plane.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces or prevents isolation deterioration, resulting in improved signal characteristics and enhanced performance of communication devices by maintaining high isolation between input and output terminals.
Implementation Method 1
A ground layer is sandwiched between the first wiring layer and second wiring layer
Data Source
AI summary
A radio-frequency module includes a multilayer substrate, an input switch, an output switch, and filters. A switch IC is disposed on a main surface of the multilayer substrate. The input switch is disposed in the switch IC and includes a first input terminal and first output terminals. The output switch is disposed in the switch IC and includes second input terminals and a second output terminal. The filters are disposed outside the switch IC and are connected to the first output terminals and the second input terminals. In a plan view of the multilayer substrate, the first input terminal and the first output terminals are disposed close to a first side of an exterior of the switch IC, and the second input terminals and the second output terminal are disposed close to a second side different from the first side of the exterior of the switch IC.