Multilayer RF Module Layout for Input-Output Isolation

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Solution Overview

Problem

As radio-frequency modules shrink in size and increase in performance, maintaining sufficient isolation between input and output terminals becomes challenging due to increased mounting density and complex arrangements of circuit elements, leading to potential deterioration of signal isolation.

Innovation Solution

A radio-frequency module configuration with strategically positioned input and output switches and filters on a multilayer substrate, where terminals are disposed to maximize separation and utilize ground terminals and conductors for electromagnetic shielding, ensuring effective isolation even with reduced switch region size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the size of the radio-frequency module is reduced and mounting density is increased, then the module size and performance are improved, but the isolation between input and output terminals deteriorates

Engineering Contradiction:
Improvemodule sizeVSAvoidisolation between terminals
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent utilizes a multilayer substrate structure where input and output signal paths are separated into different layers. Ground layers are positioned between signal layers to provide electromagnetic shielding, effectively increasing the isolation distance in the vertical dimension while maintaining a compact planar footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Ground terminals and ground conductors are introduced as intermediary elements between the input switch and output switch. These ground elements act as electromagnetic shields that block signal leakage and interference, maintaining isolation even when the switches are positioned close together in the switch region.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If the switch region size is reduced to accommodate higher mounting density, then the module integration is improved, but the separation between input and output terminals deteriorates

Engineering Contradiction:
Improvemounting densityVSAvoidterminal separation distance
Core Design Contradiction:
Device complexityVSLength of stationary object

Solution Approach 1:

The patent resolves the terminal separation issue by transitioning from planar separation to three-dimensional layering. Input and output terminals are positioned on different substrate layers with ground layers in between, achieving effective separation without increasing the lateral dimensions of the switch region.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The substrate is divided into multiple functional layers with signal paths segmented across different levels. This segmentation allows input and output terminals to be closely positioned in the planar view while maintaining electromagnetic isolation through the layered structure and ground shielding.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly reduces or prevents the deterioration of isolation between signal paths, resulting in a radio-frequency module with high isolation and excellent signal characteristics for communication devices.

Implementation Method 1

utilize ground terminals and conductors for electromagnetic shielding

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS11387856B2Radio-frequency module and communication device
Publication Date: 2022.07.12 MURATA MFG CO LTD
  • US11387856B2 patent drawing
  • US11387856B2 patent drawing
  • US11387856B2 patent drawing

AI summary

A radio-frequency module includes a multilayer substrate, an input switch, an output switch, and filters. A switch IC is disposed on a main surface of the multilayer substrate. The input switch is disposed in the switch IC and includes a first input terminal and first output terminals. The output switch is disposed in the switch IC and includes second input terminals and a second output terminal. The filters are disposed outside the switch IC and are connected to the first output terminals and the second input terminals. In a plan view of the multilayer substrate, the first input terminal and the first output terminals are disposed close to a first side of an exterior of the switch IC, and the second input terminals and the second output terminal are disposed close to a second side different from the first side of the exterior of the switch IC.