Multilayer Sealing Layer for Electronic Device Housing
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Solution Overview
Problem
Existing electronic device housings, such as mobile phone housings, face challenges with signal transmission due to strong electromagnetic signal shielding from metal materials, leading to inadequate consumer experience and short service life.
Innovation Solution
The use of a multilayer sealing layer with sub-sealing layers of different compositions to bond a metal frame and an inorganic back case, ensuring a high degree of thermal expansion coefficient match and enhancing bonding strength, mechanical properties, and reducing signal shielding effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If metal materials are used for electronic device housings, then mechanical strength and structural stability are improved, but electromagnetic signal shielding effect increases
Solution Approach 1:
The patent employs a composite material structure consisting of a metal frame and an inorganic back case (glass or ceramic). This composite design allows the metal frame to provide mechanical strength while the inorganic back case reduces electromagnetic signal shielding, enabling both 5G signal transmission and wireless charging functions to work effectively.
2Strength
If frame and back case of different materials with large thermal expansion coefficient difference are bonded, then bonding strength is improved, but reliability under temperature changes deteriorates
Solution Approach 1:
The patent introduces a sealing layer as an intermediary between the metal frame and the inorganic back case. This sealing layer acts as a transition zone that accommodates the thermal expansion coefficient difference between the two materials, reducing thermal stress and preventing bonding failure under temperature changes while maintaining strong bonding.
3Device complexity
If single-layer sealing layer is used to bond frame and back case, then device complexity is reduced, but bonding reliability under thermal stress deteriorates
Solution Approach 1:
The patent divides the sealing layer into multiple sub-sealing layers with different compositions. Each sub-sealing layer has specific properties tailored to bond with particular materials (metal or inorganic), creating a gradient structure that progressively transitions between materials with different thermal expansion coefficients, thereby improving bonding reliability under thermal stress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in an electronic device housing with improved aesthetic appeal, enhanced usability, and extended service life, capable of supporting 5G and wireless charging functions while minimizing signal interference.
Implementation Method 1
two adjacent sub-sealing layers have different compositions. The frame and the back case formed of different materials and having large difference in thermal expansion coefficients can be firmly bonded together by the sealing layer with sub-sealing layers each having different compositions. The difference between the thermal expansion coefficients of two adjacent layer structures is small, the degree of match is high, the possibility of failures due to temperature changes is significantly reduced
Data Source
AI summary
An electronic device housing, an electronic device and a compound body are provided. The electronic device housing comprises a frame; a sealing layer, disposed on at least a part of an outer surface of the frame, and including a plurality of sub-sealing layers laminated in sequence; and a back case, attached to the frame by the sealing layer, wherein two adjacent sub-sealing layers have different compositions.