Multilayer Seed Pattern Inductor Vertical Stacking
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Solution Overview
Problem
Existing multilayer seed pattern inductors face limitations in reducing direct current resistance (Rdc) and increasing inductance due to constraints on coil width and number of windings, which can lead to short-circuits and inefficiencies in magnetic material usage.
Innovation Solution
The solution involves forming a multilayer seed pattern inductor with a high aspect ratio coil conductor by creating at least two layers of seed patterns, a surface coating layer, and an upper plating layer, which increases the cross-sectional area of the coil while maintaining a narrow interval between adjacent coils, thereby reducing Rdc and enhancing inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the coil width is increased to reduce direct current resistance, then the Rdc decreases, but the interval between adjacent coils increases which may lead to larger device size and reduced manufacturing precision
Solution Approach 1:
The patent transitions from a single-layer coil structure to a multilayer seed pattern structure, adding the vertical dimension (thickness direction) to increase the effective cross-sectional area of the coil conductor. This allows Rdc reduction through increased conductive path area while maintaining narrow horizontal intervals between adjacent coils, thus resolving the contradiction between reducing Rdc and maintaining manufacturing precision.
Solution Approach 2:
The coil conductor is segmented into multiple seed patterns stacked in the thickness direction, with each seed pattern forming a layer. This segmentation allows the total conductive area to be increased through vertical stacking while keeping each individual layer's width and spacing within precise manufacturing tolerances, thereby reducing Rdc without compromising the interval precision between adjacent coils.
2Reliability
If the number of windings is increased to increase inductance, then the inductance increases, but the device size increases and magnetic material usage becomes less efficient
Solution Approach 1:
The patent utilizes the thickness direction (vertical dimension) to stack multiple seed pattern layers, increasing the effective winding count and inductance without expanding the device's planar footprint. This vertical stacking approach allows inductance enhancement while maintaining compact device size and efficient magnetic material utilization.
Solution Approach 2:
Multiple seed patterns are nested in the thickness direction, with each pattern forming a layer that contributes to the overall inductance. This nested multilayer structure enables increased inductance through vertical stacking rather than horizontal expansion, thereby reducing device size while maintaining high inductance values.
3Ease of manufacture
If a single-layer seed pattern is used to simplify manufacturing, then the manufacturing process is simpler, but the cross-sectional area of the coil is limited which prevents further Rdc reduction
Solution Approach 1:
The manufacturing process is segmented into multiple identical steps (forming seed patterns layer by layer), where each layer is formed using the same plating and coating processes. This segmentation into repetitive modular steps maintains ease of manufacture through process standardization while achieving the goal of reduced Rdc through increased total cross-sectional area via vertical stacking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively decreases direct current resistance and increases inductance by increasing the coil's cross-sectional area without risking short-circuits, thus improving the overall efficiency of the inductor.
Implementation Method 1
forming coil conductors on two opposing surfaces of an insulating substrate to form an internal coil part... The forming of the coil conductors can include forming a seed pattern including at least two layers on the insulating substrate, forming a surface coating layer covering the seed pattern, and forming an upper plating layer on an upper surface of the surface coating layer
Implementation Method 2
forming a magnetic body by curing a magnetic powder-resin composite obtained by mixing magnetic powder and a resin with each other
Data Source
AI summary
A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.