Multilayer Electronic Device Self-Patterning for Scribing-Free Fabrication

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Solution Overview

Problem

The fabrication of multilayer electronic devices, particularly thin-film devices, is complicated and costly due to the need for precise laser scribing and alignment processes, which can lead to inefficiencies and increased production costs, and may result in low resistance points or shunts between electrodes.

Innovation Solution

The use of intermediate structures that facilitate self-patterning during deposition, eliminating the need for laser scribing by exploiting shadow effects to create electrical connections and separations between layers, thereby simplifying the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If laser scribing and alignment processes are used to fabricate multilayer electronic devices, then electrical connections and separations between layers can be achieved, but manufacturing complexity and production costs increase

Engineering Contradiction:
Improveelectrical connection qualityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs self-aligned deposition processes where previously deposited layers automatically serve as alignment references for subsequent layers. The shadow masks are positioned relative to existing structures, eliminating the need for external alignment tools and complex laser scribing procedures. This self-service mechanism maintains electrical connection reliability while dramatically simplifying the manufacturing process.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent performs preliminary deposition of guide layers and shadow masks before final electrode deposition. These preliminary structures are deposited with precise geometric relationships that pre-establish alignment for subsequent layers. By performing alignment-critical actions during the deposition sequence rather than through post-deposition laser scribing, the method achieves reliable electrical connections without complex manufacturing steps.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If laser scribing processes are used to create separations between layers, then electrical isolation can be achieved, but production time and manufacturing costs increase

Engineering Contradiction:
Improveelectrical isolationVSAvoidproduction speed
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent maintains continuous deposition processes throughout the fabrication sequence, avoiding interruptive laser scribing steps. Shadow masks remain in place during sequential depositions, allowing material to be continuously deposited across multiple layers without stopping for alignment or cutting operations. This continuous action achieves electrical isolation through the mask geometry itself rather than through interruptive scribing, thereby maintaining high production speed.

Inventive Principle:
Principle #20Continuity of useful action

Solution Approach 2:

The patent extracts the alignment and isolation functions from the final deposition step and incorporates them into the shadow mask design used during deposition. By taking out the need for post-deposition laser scribing and embedding the isolation geometry in the mask structure itself, the method achieves electrical isolation without sacrificing production speed.

Inventive Principle:
Principle #2Taking out (Extraction)

3Manufacturing precision

If precise alignment tools and complex scribing processes are used, then layer alignment accuracy can be achieved, but manufacturing simplicity is reduced

Engineering Contradiction:
Improvelayer alignment accuracyVSAvoidmanufacturing simplicity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent uses self-aligned deposition where each deposited layer automatically references previously deposited structures for positioning. The shadow masks are attached to or positioned relative to existing layers, using those layers as their own alignment references. This self-service approach achieves high layer alignment accuracy without requiring external alignment tools or complex scribing processes, thereby maintaining manufacturing simplicity.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent transitions from planar alignment problems to three-dimensional shadow mask positioning. By depositing shadow masks at angles or with specific vertical profiles, the method creates geometric relationships that automatically define horizontal alignment for subsequent layers. This dimensional change converts a complex two-dimensional alignment problem into a simpler geometric constraint problem solved by the deposition geometry itself.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method reduces manufacturing costs and improves efficiency by eliminating the need for precise alignment tools and complex scribing processes, enhancing the overall performance of the multilayer devices.

Implementation Method 1

depositing an upper conducting layer on top of the electronic layer, wherein, during depositing the upper conducting layer, the intermediate structure provides a shaded area such that, during depositing the upper conducting layer, a plurality of separated upper conducting layers is obtained

Methodology Applied
Scientific EffectShadow effect: Shadow

Data Source

PatentUS12364144B2Multilayer electronic device and method for producing the same
Publication Date: 2025.07.15 FRESHAPE SA
  • US12364144B2 patent drawing
  • US12364144B2 patent drawing
  • US12364144B2 patent drawing

AI summary

The present invention concerns an electronic device, preferably a thin film electronic device, and a method for producing the device. The device comprises an intermediate structure (301, 401, 501) at the interface between neighboring unit devices connected in series. The intermediate structure is suitable to employ deposition techniques that make it possible to avoid steps of scribing or patterning insulating and/or separating lines between adjacent layers of the device.