Multilayer Semiconductor Measurement Using Dynamic Condition Adjustment

The patent segments the measurement process into layer-specific measurement points for each semiconductor layer. Instead of treating all measurement points uniformly across the entire circuit element, the system divides measurement tasks by layer, allowing targeted measurement at critical interfaces between layers. This segmentation reduces the complexity of managing numerous measurement points while maintaining precision at each layer level.

The patent introduces a vertical dimension to measurements by measuring not only within individual layers but also across layer interfaces. The measurement system now operates in three dimensions by capturing both in-plane measurements within layers and vertical measurements at layer boundaries, enabling comprehensive evaluation of multilayered structure without proportionally increasing measurement point complexity.

The patent performs preliminary identification and classification of measurement points by layer before actual measurement begins. The system pre-organizes measurement points into layer-specific groups and establishes the measurement sequence in advance, allowing the measurement system to efficiently navigate and measure points across multiple layers without time-consuming on-the-fly decisions during data collection.

The patent ensures continuous measurement action by establishing an efficient measurement sequence that flows smoothly through layer interfaces. The system maintains continuous data collection without unnecessary interruptions or repetitions when moving between layers, ensuring that each measurement point is visited exactly once in the optimal sequence, thereby minimizing total measurement time while maintaining comprehensive coverage.

The patent creates a universal measurement framework that can handle both traditional 2D measurements within individual layers and new 3D measurements across layer interfaces. The same measurement system and software platform perform both functions, making the system adaptable to various measurement scenarios without requiring separate specialized equipment for different measurement types.

The patent implements a nested measurement structure where 2D measurement points within layers are nested within a broader 3D measurement framework that includes vertical layer interface measurements. The measurement system first handles traditional 2D measurements within each layer, then nests these results within a comprehensive 3D evaluation that adds layer-to-layer relationships, creating a hierarchical measurement approach that maintains simplicity while adding capability.