Multilayer Semiconductor Fabrication via Single Conductor Process
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Solution Overview
Problem
The complexity and cost of fabricating multilayer structures for semiconductor devices increase with the number of layers, due to the need for extensive conductive material and intricate processing.
Innovation Solution
A method that forms multiple conductive layers and interlayer connectors using a single conductor process, where patterned sacrificial layers and insulating layers are alternately stacked, allowing interlayer connectors to directly contact conductive layers, reducing material usage and processing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate conductor processes are used to form conductive layers and interlayer connectors, then electrical connectivity is achieved, but process complexity and fabrication cost increase
Solution Approach 1:
The patent merges the formation of conductive layers and interlayer connectors into a single conductor process. The conductive material is simultaneously deposited to form both the conductive layers (in lateral openings) and interlayer connectors (in vertical openings), eliminating the need for separate conductor processes and reducing overall process complexity while maintaining electrical connectivity
Solution Approach 2:
The single conductor process serves multiple functions: it forms conductive layers for lateral electrical connections, creates interlayer connectors for vertical electrical connections, and establishes electrical continuity between different interlayer connectors through the conductive layers. This multi-functional approach reduces the total number of process steps required
2Reliability
If multiple separate conductor processes are used to form conductive layers and interlayer connectors, then electrical connectivity is achieved, but fabrication cost increases
Solution Approach 1:
The patent combines multiple conductor processes into one, reducing fabrication cost by eliminating redundant process steps, material deposition cycles, and associated equipment usage. The single conductor process uses one set of process parameters and materials to achieve both conductive layer and interlayer connector formation
Solution Approach 2:
The sacrificial layers are removed after serving their temporary purpose of defining the lateral openings. By removing these sacrificial structures, the patent enables the formation of conductive layers only in the required lateral regions, preventing waste of conductive material in areas where it is not needed, thus reducing overall material cost
3Reliability
If extensive conductive material is used to form multiple conductive layers and interlayer connectors, then electrical connectivity is achieved, but material cost and process complexity increase
Solution Approach 1:
The patent applies local quality by forming conductive layers only in specific lateral regions where electrical connection is needed, rather than depositing conductive material uniformly across the entire substrate. The sacrificial layers define precise locations for conductive layer formation, ensuring material is placed only where functionally required
Solution Approach 2:
Sacrificial layers are temporarily used to define the geometry of lateral openings, then removed after serving their purpose. This approach prevents the need to form conductive layers in unnecessary areas, reducing the total quantity of conductive material required while maintaining electrical connectivity where needed
Data Source
AI summary
A multilayer structure includes a substrate and a plurality of sub-stacks extending along a first direction respectively and disposed on an upper surface of the substrate along a second direction. Each of the sub-stacks includes insulating layers and patterned sacrificial layers alternately stacked on the upper surface along a third direction; conductive layers alternately stacked on the upper surface with the insulating layers along the third direction; and interlayer connectors extending along the third direction; wherein the patterned sacrificial layers have first sides and second sides opposite to the first sides, the conductive layers include first side conductive layers corresponding to the first sides and second side conductive layers corresponding to the second sides; wherein the interlayer connectors are electrically connected and directly contact corresponding ones of the conductive layers, and the first direction, the second direction, and the third direction are crossed.