Multilayer Sensor Panel Structure for Impact-Resistant Foldable Devices
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Solution Overview
Problem
Electronic devices with sensor panels are prone to damage from impacts during carrying, necessitating a structure to prevent or reduce such damage.
Innovation Solution
The electronic device incorporates a sensor panel with a supporting layer made of polymer material, adhesive contact, and multiple insulating and conductive layers, including a thicker insulating layer to enhance robustness against external impacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the sensor panel is made thinner to reduce device weight and improve flexibility, then the device portability is improved, but the sensor panel becomes more susceptible to damage from impacts during carrying
Solution Approach 1:
The patent applies beforehand cushioning by introducing a separate protective layer or structural modification to the sensor panel that provides impact resistance before damage can occur. This protective structure is designed to absorb or dissipate impact forces during carrying, allowing the sensor panel to remain thin and lightweight while gaining durability against accidental drops and impacts.
2Reliability
If the sensor panel structure is reinforced to prevent damage during carrying, then the sensor panel durability is improved, but the device complexity increases
Solution Approach 1:
The patent employs flexible shells and thin films as the protective structure for the sensor panel. Instead of adding rigid, complex reinforcement layers, the invention uses flexible protective films that can be integrated into the existing sensor panel structure. These thin film structures provide impact resistance while maintaining the overall simplicity and flexibility of the device design.
3Reliability
If multiple insulating and conductive layers are added to the sensor panel to enhance impact resistance, then the sensor panel durability is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent applies composite materials by combining multiple insulating and conductive layers into an integrated sensor panel structure. These composite layers are designed to work together to provide impact resistance while maintaining electrical functionality. The composite structure is manufactured as a unified assembly, reducing the complexity of assembling multiple separate components and streamlining the manufacturing process.
Data Source
AI summary
An electronic device may include: a first housing; a second housing; a hinge structure; a display; and a sensor panel, wherein the sensor panel comprises: a support layer which comprises a polymer inclusive material and is in contact with an adhesive material arranged on at least one of a first surface of the first housing and a third surface of the second housing; a shielding layer arranged on the support layer; a first insulating layer arranged on the shielding layer; a first conductive pattern arranged on the first insulating layer; a second insulating layer arranged on the first conductive pattern; a second conductive pattern arranged on the second insulating layer; and a third insulating layer arranged on the second conductive pattern and facing one surface of the display, wherein the thickness of at least one of the first insulating layer and the third insulating layer is greater than the thickness of the second insulating layer.