Multilayer Electronic Component Side Insulation via Adhesive Sheet Transfer

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Solution Overview

Problem

Existing methods for manufacturing electronic components with multilayer bodies face challenges in efficiently forming insulating layers on side surfaces, particularly for large-scale production, as conventional techniques do not provide a specific method for effectively covering and bonding these surfaces.

Innovation Solution

A method involving the use of adhesive sheets to bond and convey unfired multilayer bodies, followed by polishing and affixing insulating sheets to the side surfaces, allowing for efficient formation of insulating layers by applying pressing forces and cutting the sheets to separate the components, thereby reducing gaps and peeling issues.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional methods are used to form insulating layers on side surfaces of multilayer bodies, then the insulating layer can be formed, but the process is inefficient and difficult to implement for large-scale production

Engineering Contradiction:

Improveefficiency of forming insulating layerVSAvoiddifficulty of forming insulating layer on side surface

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The side surfaces of the multilayer body are ground and polished before the insulating layer is formed, preparing the surface in advance to ensure proper adhesion and flatness for subsequent insulating layer formation, making the process more efficient and reliable

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

An adhesive sheet is introduced as an intermediary carrier to bond the multilayer body during the grounding and polishing processes, enabling efficient material removal and surface preparation while maintaining positional stability, which would be difficult to achieve through direct handling

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If insulating layer is formed on unpolished side surfaces, then the process is simpler, but gaps and peeling issues occur reducing reliability

Engineering Contradiction:

Improveadhesion of insulating layerVSAvoidcomplexity of surface preparation process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The side surfaces are ground and polished before insulating layer formation to remove defects, ensure flatness, and create proper surface conditions for adhesion, preventing gaps and peeling issues that would compromise reliability

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Mechanical grinding and polishing processes are used to prepare the surface, replacing less effective methods and ensuring consistent surface quality that promotes reliable insulating layer adhesion

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables efficient and reliable formation of insulating layers on side surfaces of multilayer bodies, reducing the occurrence of gaps and peeling issues, thus facilitating the mass production of electronic components with improved reliability.

Implementation Method 1

bonding one main surface of the first main surface and the second main surface of the unfired multilayer body to a first adhesive sheet having an elongated shape

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

polishing another side surface of the first side surface and the second side surface of the unfired multilayer body

Methodology Applied

Scientific EffectAbrasion: Abrasion

Data Source

PatentUS11875949B2Method of manufacturing electronic component

Publication Date: 2024.01.16 MURATA MFG CO LTD

AI summary

A method of manufacturing an electronic component includes preparing an unfired multilayer body including first and second main surfaces facing each other in a stacking direction, first and second side surfaces facing each other in a width direction, and first and second end surfaces facing each other in a length direction, bonding one main surface of the unfired multilayer body to an elongated first adhesive sheet, conveying the first adhesive sheet in a first direction in which the first adhesive sheet approaches an elongated second adhesive sheet, and bonding one side surface of the unfired multilayer body to the second adhesive sheet, conveying the second adhesive sheet in a second direction different from the first direction to peel off the unfired multilayer body from the first adhesive sheet, polishing another side surface of the unfired multilayer body, and forming a first insulating layer on the polished another side surface.