Multilayer Electronic Component Side Margins Using Dual-Modulus Compression
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Solution Overview
Problem
The existing methods for manufacturing multilayer ceramic capacitors face challenges in efficiently forming side margin portions, which can lead to defects and reliability issues such as moisture penetration and short-circuiting, especially when external electrodes are extended to exposed side surfaces.
Innovation Solution
A method involving the use of a first and second elastic body with different elastic moduli to compress and attach ceramic green sheets for side margin portions to unit chips, optimizing the elastic modulus between 50 MPa and 1000 MPa to prevent damage and cutting defects, and rotating the unit chips before attachment to enhance the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If side margin portions are attached to unit chips by compression, then the attachment strength is improved, but cutting defects and damage may occur
Solution Approach 1:
The patent applies parameter changes by optimizing the elastic modulus of the elastic body to a specific range (50-1000 MPa) to resolve the contradiction between attachment strength and cutting quality. This parameter optimization allows the elastic body to provide sufficient compression force for strong attachment while maintaining enough elasticity to prevent cutting defects and damage to the ceramic green sheets and internal electrodes.
Solution Approach 2:
The patent introduces an elastic body as an intermediary between the compression force and the unit chips. This intermediary element distributes the compression force uniformly and controllably, enabling strong attachment of side margin portions while avoiding direct mechanical damage and cutting defects that would occur with rigid compression.
2Reliability
If marginless design is applied to maximize internal electrode area, then capacitance is improved, but moisture resistance deteriorates
Solution Approach 1:
The patent applies preliminary action by attaching side margin portions made of ceramic green sheets to the unit chips before sintering. This preliminary protective layer is formed in advance to cover the exposed internal electrodes on the side surfaces, preventing moisture penetration during subsequent processing and application, while maintaining the marginless design for maximum capacitance.
Solution Approach 2:
The patent converts the potential harm of exposed internal electrodes (moisture penetration risk) into a benefit by using the same ceramic green sheet material that forms the main body of the capacitor. The side margin portions are created from the ceramic green sheets themselves, transforming the vulnerability of exposed electrodes into a protective feature that maintains both high capacitance and moisture resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents defects during the attachment of side margin portions, improves moisture resistance, and reduces the risk of short-circuiting, thereby enhancing the reliability and capacitance of multilayer electronic components.
Implementation Method 1
attaching the portion of the ceramic green sheet for a side margin portion to the plurality of unit chips by compression between a first elastic body on which the ceramic green sheet for a side margin portion is disposed and the plurality of unit chips
Implementation Method 2
The first elastic body includes a first elastic layer having a first elastic modulus and a second elastic layer having a second elastic modulus, different from the first elastic modulus
Implementation Method 3
The first elastic body includes a first elastic layer having a first elastic modulus and a second elastic layer having a second elastic modulus, different from the first elastic modulus, and disposed between the plurality of unit chips and the first elastic layer
Data Source
AI summary
A method of manufacturing a multilayer electronic component includes cutting a stack, in which internal electrode patterns and ceramic green sheets are alternately stacked in a stacking direction, to obtain unit chips and attaching a portion of a ceramic green sheet for a side margin portion to the unit chips in a direction, different from the stacking direction. The attaching includes attaching the portion of the ceramic green sheet to the unit chips by compression between a first elastic body on which the ceramic green sheet is disposed and the unit chips. The first elastic body includes a first elastic layer having and a second elastic layer having an elastic modulus different from the first elastic layer, and disposed between the unit chips and the first elastic layer. An elastic modulus of the first elastic body is greater than 50 MPa and less than or equal to 1000 MPa.