Multilayer Ceramic Side Margins With Two-Stage Binder Removal
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Solution Overview
Problem
The existing manufacturing method for multilayer ceramic electronic components, such as capacitors, is complicated by the need for adhesive application on side surfaces and prone to sticking of side margin portions during the heating process, making handling difficult.
Innovation Solution
A method involving thermocompression bonding of a ceramic sheet with 10% or more binder resin to form side margin portions, followed by two-stage heat treatments at different temperatures to remove the binder resin, reducing the number of processes and preventing sticking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive is applied to the side surface to form side margin portions, then the side surfaces are protected and internal electrodes are covered, but the manufacturing process becomes complicated
Solution Approach 1:
The invention extracts the adhesive application step from the manufacturing process by using a ceramic sheet with inherently high adhesive properties. The ceramic sheet itself serves as the bonding medium through its adhesive layer, eliminating the need for a separate adhesive application process while maintaining the protective function of side margin portions.
Solution Approach 2:
The ceramic sheet is designed to perform multiple functions: it provides the adhesive bonding function through its adhesive layer, serves as the side margin portion material, and protects the internal electrodes. This multi-functionality consolidates what would otherwise be separate processes into a single integrated component.
2Strength
If highly adhesive ceramic sheet is used to form side margin portions, then the bonding strength is improved, but the side margin portions of different ceramic main bodies stick together during heating
Solution Approach 1:
The invention applies local quality by making the adhesive properties location-specific. The adhesive layer is present only on the surfaces that need bonding (the sides of the ceramic main bodies), while the side margin portions themselves have reduced adhesiveness to prevent unwanted sticking. This spatial differentiation of adhesive properties resolves the contradiction between bonding strength and preventing sticking.
Solution Approach 2:
The invention changes the adhesive parameter selectively: the ceramic sheet has high adhesive content (10% or more) for effective bonding, but the side margin portions are designed with lower adhesiveness to prevent sticking during heating. This parameter differentiation allows the system to achieve both strong bonding and prevent harmful sticking simultaneously.
3Productivity
If the number of processes is reduced by eliminating adhesive application, then manufacturing efficiency is improved, but reliable bonding of side margin portions may be compromised
Solution Approach 1:
The ceramic sheet performs self-service by providing its own adhesive layer for bonding. The adhesive layer is an integral part of the ceramic sheet structure, allowing the sheet to bond to itself and to the ceramic main bodies without requiring external adhesive application. This self-service mechanism maintains bonding reliability while eliminating the need for separate adhesive processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the process by eliminating the need for adhesive application and effectively prevents sticking of side margin portions, ensuring efficient handling and alignment of internal electrodes.
Implementation Method 1
forming a pair of side margin portions on side surfaces of each of a plurality of unfired laminates, respectively, by thermocompression bonding a ceramic sheet containing 10% by mass or more of a binder resin to one of the side surfaces of the laminate
Implementation Method 2
performing a first heat treatment on the plurality of laminates having the pair of side margin portions formed thereon in a first condition so as to remove a portion of the binder resin contained in the side margin portions
Implementation Method 3
performing a second heat treatment on the plurality of laminates having the pair of side margin portions formed thereon in a second condition that is different from the first condition so as to remove a remaining binder resin from the side margin portions
Data Source
AI summary
A method for manufacturing a multilayer ceramic electronic component includes: forming a pair of side margin portions on side surfaces of each of a plurality of unfired laminates, respectively, by thermocompression bonding a ceramic sheet containing 10% by mass or more of a binder resin to one of the side surfaces of the laminate for forming each of the side margin portions, performing a first heat treatment on the plurality of laminates having the pair of side margin portions formed thereon in a first condition so as to remove a portion of the binder resin contained in the side margin portions; and thereafter, performing a second heat treatment on the plurality of laminates having the pair of side margin portions formed thereon in a second condition that is different from the first condition so as to remove a remaining binder resin from the side margin portions.