Multilayer Sintered Ceramic Body for Plasma Chambers
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Solution Overview
Problem
Current semiconductor plasma processing chambers face challenges with corrosion and erosion of chamber components due to halogen-based plasmas, leading to particle contamination and yield loss, as existing corrosion-resistant coatings and films exhibit poor adhesion, porosity, and mechanical strength, especially in large dimensions.
Innovation Solution
A multilayer sintered ceramic body comprising polycrystalline YAG, alumina, and zirconia layers with controlled porosity and thermal expansion mismatch, formed through a specific powder mixture and sintering process, providing enhanced corrosion resistance, mechanical strength, and improved machinability for large-scale semiconductor processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If corrosion resistant films or coatings are deposited atop a base substrate, then corrosion and erosion resistance is improved, but inter-layer adhesion deteriorates leading to delamination and cracking
Solution Approach 1:
The patent combines the corrosion resistant layer and base substrate into a single co-sintered unitary structure rather than depositing a separate film. The layers are formed from mixed powders and sintered together in one process, creating strong interfacial bonds while maintaining corrosion resistance. This eliminates the delamination and cracking problems associated with separately deposited films.
Solution Approach 2:
The patent uses composite ceramic materials where different ceramic powders (e.g., alumina, zirconia, magnesia) are mixed and co-sintered to create a unitary structure with tailored properties. The composite nature provides both corrosion resistance and mechanical strength, with good inter-layer adhesion achieved through the co-sintering process.
2Reliability
If vapor deposition methods are used to deposit corrosion resistant films, then corrosion resistance is improved, but film thickness is limited and porosity increases
Solution Approach 1:
The patent replaces the vapor deposition process with a co-sintering process. Instead of depositing thin films through vapor phase, the corrosion resistant layer is formed by compacting and sintering ceramic powders in a controlled mechanical process, enabling much greater thickness without porosity or cracking issues.
3Reliability
If aerosol or plasma spray techniques are used to create corrosion resistant coatings, then corrosion resistance is improved, but porosity increases to 3-50% and adhesion deteriorates
Solution Approach 1:
The patent replaces aerosol and plasma spray techniques with a co-sintering process. The spray processes inherently create porous structures, while the co-sintering method produces a dense, non-porous structure by consolidating ceramic powders under heat and pressure, achieving both corrosion resistance and high density.
4Ease of manufacture
If pressureless sintering is used to laminate pre-cast films, then manufacturing is simplified, but flatness deteriorates due to mismatched sintering rates
Solution Approach 1:
The patent combines multiple layers into a single compact before sintering, rather than laminating pre-sintered films. This allows all layers to sinter simultaneously at the same rate, maintaining flatness and dimensional control while keeping the process simple and pressure-based.
5Loss of energy
If highly pure starting powders are used with manufacturing processes retaining initial purity, then dielectric loss is reduced, but corrosion resistance in plasma environments deteriorates
Solution Approach 1:
The patent uses composite ceramic materials with high purity starting powders. By carefully selecting and combining pure ceramic powders (alumina, zirconia, magnesia) in specific ratios, the material achieves both low dielectric loss and high corrosion resistance simultaneously, rather than having to trade off between these properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multilayer sintered ceramic body offers improved plasma resistance, low dielectric loss, high thermal conductivity, and enhanced mechanical strength, reducing particle contamination and enabling the fabrication of large-scale semiconductor devices with increased reliability and yield.
Implementation Method 1
consisting of a first layer comprising polycrystalline YAG, wherein the at least one first layer comprising polycrystalline YAG comprises pores wherein the pores have a maximum size of from 0.1 to 5 μm
Implementation Method 2
wherein the at least one first layer comprising polycrystalline YAG comprises pores wherein the pores have a maximum size of from 0.1 to 5 μm
Data Source
AI summary
Disclosed herein is a multilayer sintered ceramic body comprising at least one first layer comprising poly crystalline YAG, wherein the at least one first layer comprising poly crystalline YAG comprises pores wherein the pores have a maximum size of from 0.1 to 5μm, at least one second layer comprising alumina and zirconia wherein the zirconia comprises at least one of stabilized and partially stabilized zirconia, and at least one third layer comprising at least one of YAG, alumina, and zirconia, wherein an absolute value of the difference in coefficient of thermal expansion (CTE) between the at least one first, second and third layers is from 0 to 0.75×10-6/° C. as measured in accordance with ASTM E228-17, wherein the at least one first, second and third layers form a unitary, multilayer sintered ceramic body. Methods of making are also disclosed.