Multilayer Body Step-Pad Structure for Stronger Solder Connections
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Solution Overview
Problem
Existing multilayer bodies face challenges in achieving strong connections while maintaining a reduced size, as the connection strength between electronic components is often compromised by thermal stress and increased size due to larger connection areas.
Innovation Solution
A multilayer body design featuring a step difference in height between regions, with a connection pad strategically placed to increase the surface area of contact between components, utilizing solder bumps to enhance connection strength and prevent breakage, while maintaining a compact size by distributing thermal stress effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the area of the connection portion between terminals and electronic component is increased to improve connection strength, then connection strength is improved, but the size of the multilayer body increases
Solution Approach 1:
The connection pad extends in the height direction by utilizing the step difference between the first region and second region of the structural body. This vertical extension increases the connection area without expanding the planar footprint, thereby improving connection strength while maintaining a compact multilayer body size.
Solution Approach 2:
The connection pad is strategically positioned on the step-difference surface where the first region and second region meet. This localized placement concentrates the connection area enhancement precisely where needed for joining electronic components, maximizing connection strength improvement while minimizing overall size increase.
2Reliability
If the area of the connection portion is increased to prevent breakage under thermal stress, then reliability is improved, but the device complexity increases
Solution Approach 1:
By extending the connection pad vertically along the step-difference surface, the design increases the connection area to distribute thermal stress more effectively. This approach improves reliability under thermal cycling without requiring complex additional structures or components.
Solution Approach 2:
The connection pad integrates multiple functions: it provides mechanical connection, electrical connection, and stress distribution. By combining these functions into a single structural element that utilizes the existing step difference, the design improves reliability without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly enhances connection strength and prevents breakage by increasing the contact area between components, while keeping the overall size of the multilayer body minimized, effectively addressing the limitations of previous technologies.
Implementation Method 1
mounting a second electronic component via a solder bump onto the structural body with a connection pad interposed therebetween
Data Source
AI summary
A multilayer body includes a first electronic component and a structural body including first and second regions. The first electronic component is in the second region. The multilayer body includes a second electronic component mounted via a solder bump onto the structural body with a connection pad interposed therebetween. An outer surface of the first region and an outer surface of the first electronic component have a step difference therebetween in a height direction of the structural body. The connection pad is on the outer surface of the first region, an outer surface of the first electronic component, and a step-difference surface of a portion of the step difference.