Multilayer Structure With Embedded Connector Hole
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Solution Overview
Problem
Existing multilayer electronic structures face challenges in efficiently integrating electrical connectors without compromising the structural integrity and design flexibility, often requiring external wiring that constrains dimensioning and positioning.
Innovation Solution
A multilayer structure with a substrate film and molded plastic layer, featuring a connector element with conductive contact members accessible through a hole, allowing for internal electrical connections to external elements without the need for external wiring, using printed electronics and overmolding techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connectors are provided at the side edge of the structure with external wiring, then electrical connections to embedded electronics are established, but the dimensioning and positioning of host structures and components are constrained
Solution Approach 1:
The connector element is moved from the peripheral side edge (2D surface location) to the interior of the structure (3D volumetric location), accessible through a hole in the substrate film. This dimensional transition allows connectors to be positioned anywhere on the substrate film rather than being constrained to the perimeter, thereby resolving the contradiction between reliable electrical connection and positioning flexibility.
2Ease of manufacture
If external wiring is used to connect to connectors at the periphery, then electrical connections are provided, but the multilayer structure manufacturing and design are constrained
Solution Approach 1:
The connector element is merged with and embedded in the molded plastic layer, becoming an integrated component of the multilayer structure rather than a separate peripheral element. This consolidation eliminates the need for separate external wiring arrangements and reduces design complexity while maintaining ease of manufacture through the molding process.
3Ease of operation
If connectors are located at the periphery of the structure, then external wiring can access them, but additional constraints are imposed on host structure dimensioning and positioning
Solution Approach 1:
The connector element is relocated from the 2D peripheral surface to the 3D interior space accessible through a hole in the substrate film. This allows external elements to access connectors from the front side through the hole, eliminating the need for side-edge access and restoring full dimensioning freedom to the host structure while maintaining ease of operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible integration of electrical connectors within the multilayer structure, reducing the need for external wiring and enhancing structural versatility, while maintaining functional integrity and aesthetic features.
Implementation Method 1
a plastic layer molded onto said first side of the substrate film and said one side of the connector element so as to cover said one side of the connector element and the circuit
Data Source
Figure 1~2
Figure 3
Figure 4A~4C
AI summary
Multilayer structure (100), comprising a substrate film (102) having a first side and opposite second side, said substrate film (102) comprising electrically substantially insulating material, a number of conductive traces (108) on the first side of the substrate film (102) for establishing a desired predetermined circuit design, a connector element (118) provided to, preferably substantially laid upon the first side of, said substrate film (102), one side of the connector element (118) facing the structure internals and the other, opposite side facing the environment on the second side of the substrate film (102) via at least one hole (102B) defined in the substrate film (102), said connector element (118) comprising a number of electrically conductive contact members (118A) electrically connected to the circuit on the first side of the substrate film (102) and configured to contact one or more electrical contact members of an external element (119) responsive to mating (124) the external element (119) with the connector element (118), and a plastic layer (104) molded onto said first side of the substrate film (102) and said one side of the connector element (118) so as to cover said one side of the connector element and the circuit. Related method of manufacture is presented.