Multilayer Styrenic Resin Sheet Reduces Flash
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Solution Overview
Problem
Existing embossed carrier tapes for electronic components suffer from significant flash and burr issues during slitting and punching processes, which are not adequately addressed by current technologies, regardless of the slitting method or molding equipment used.
Innovation Solution
A multilayer styrenic resin sheet is developed, comprising 10 to 50 stacked layers with specific compositions of styrene-conjugated diene block copolymer, polystyrene resin, and high impact polystyrene resin, optimized for reduced flash and burr occurrence, with each layer having an average thickness of 2 to 50 μm and specific molecular weight distributions to enhance moldability and strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional thermoplastic resin sheets are used for embossed carrier tapes, then transparency and cost-effectiveness are improved, but flash and burr occurrence during slitting and punching increases significantly
Solution Approach 1:
The patent applies composite materials by creating a multilayer sheet structure where different resin compositions are stacked together. Specifically, it combines a first styrenic resin composition (29-65 mass % styrene-conjugated diene block copolymer, 51-15 mass % polystyrene resin, 20-9 mass % high impact polystyrene resin) with a second styrenic resin composition having different ratios, forming a composite structure that reduces flash and burr occurrence while maintaining transparency and cost-effectiveness
Solution Approach 2:
The patent applies segmentation by dividing the sheet into multiple thin layers (10-50 layers, each 2-50 μm thick) rather than using a single thick layer. This segmentation of the resin structure allows each layer to deform independently during punching and slitting, significantly reducing the occurrence of flash and burrs while maintaining the overall transparency and mechanical properties of the carrier tape
2Adaptability or versatility
If various slitting methods and molding equipment are used for embossment, then production flexibility is improved, but flash and burr issues persist across different equipment types
Solution Approach 1:
The patent applies parameter changes by precisely controlling the composition ratios of the resin components (styrene-conjugated diene block copolymer: 29-65 mass %, polystyrene resin: 51-15 mass %, high impact polystyrene resin: 20-9 mass %) and the physical parameters (layer thickness: 2-50 μm per layer, number of layers: 10-50). These parameter optimizations ensure that the sheet performs consistently across different slitting methods and molding equipment, reducing flash and burr occurrence regardless of the specific equipment used
Data Source
AI summary
Disclosed are a multilayer styrenic resin sheet including 10 to 50 laminated layers which are each made of a styrenic resin composition that includes 29 to 65 mass % of a styrene/conjugated diene copolymer (A), 51 to 15 mass % of a polystyrene resin (B) and 20 to 9 mass % of an impact-resistant polystyrene resin (C) and which each have an average thickness of 2 to 50 μm; and a packaging material (such as carrier tape or tray) for electronic components which is formed from the multilayer styrenic resin sheet. The melt tension of the styrenic resin composition at 220° C. is preferably 10 to 30 mN, and the content of the conjugated diene is preferably 10 to 25 mass % relative to 100 mass % of the copolymer (A).