Multilayer Substrate Layout for Antenna Tuning Without Reauth

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Solution Overview

Problem

The challenge is to adjust antenna characteristics of small wireless modules without compromising the validity of pre-obtained wireless authentication, as these characteristics can be affected by the substrate material and mounting location, requiring modifications that invalidate the authentication.

Innovation Solution

A multilayer substrate with a first dielectric layer and a conductive layer, featuring auxiliary conductors and connecting pads that allow for selective connection to adjust impedance characteristics without modifying the wireless module, thereby allowing antenna characteristics to be adjusted post-mounting without affecting authentication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the wireless module is mounted on a substrate, then the wireless module can be used for wireless communication, but the antenna characteristics may be affected by the substrate material and thickness, requiring modification of the wireless module which invalidates the wireless authentication

Engineering Contradiction:
Improvewireless authentication validityVSAvoidantenna characteristic adjustment
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The invention divides the antenna system into two independent parts: the wireless module containing the antenna (which remains unmodified to preserve authentication) and the substrate containing adjustable conductor portions (which are modified to adjust characteristics). This segmentation allows the substrate to compensate for antenna characteristic changes without requiring modification of the authenticated wireless module.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The substrate acts as an intermediary element between the wireless module and the external environment. By providing adjustable conductor portions on the substrate, the invention creates a mediator that can modify the electromagnetic environment around the antenna, thereby adjusting antenna characteristics without touching the authenticated wireless module itself.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If modifications are made to the wireless module to adjust antenna characteristics, then the antenna characteristics can be optimized, but the wireless authentication becomes invalid

Engineering Contradiction:
Improveantenna characteristic adjustmentVSAvoidwireless authentication validity
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

Instead of modifying the wireless module to adjust antenna characteristics (the conventional approach), the invention inverts the approach by modifying the substrate on which the wireless module is mounted. The conductor portions on the substrate are adjusted to achieve the desired antenna characteristics, while the wireless module itself remains completely unmodified, preserving its authentication validity.

Inventive Principle:
Principle #13The other way round (Inversion)

3Adaptability or versatility

If the conductor portion is disposed close to the antenna, then the adjustment effect on antenna characteristics is more significant, but the area occupied by the conductor portion increases

Engineering Contradiction:
Improveantenna characteristic adjustment capabilityVSAvoidsubstrate area
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The conductor portions are strategically positioned in specific local regions on the substrate near the wireless module, rather than being uniformly distributed across the entire substrate. This localized placement allows the conductor portions to exert their maximum influence on the antenna characteristics while occupying minimal substrate area, achieving high adjustment capability with small area occupation.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12119857B2Multilayer substrate and wireless module mounted substrate
Publication Date: 2024.10.15 LAPIS SEMICON CO LTD
  • US12119857B2 patent drawing
  • US12119857B2 patent drawing
  • US12119857B2 patent drawing

AI summary

A multilayer substrate includes a first dielectric layer, a first conductive layer, and a conductor portion. The first dielectric layer has a first region. The first conductive layer is laminated on the first dielectric layer, excluding the first region. The conductor portion has one or more auxiliary conductors disposed at a distance from the first conductive layer, and one or more connecting conductors that connect said one or more auxiliary conductors to the first conductive layer.