Multilayer Substrate Coil Conductor Layout for Parasitic Capacitance Reduction

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Solution Overview

Problem

Existing multilayer substrates with coils and capacitors face challenges in mounting to external circuit boards due to limited land conductor shapes and generate unnecessary capacitance, which affects desired filter characteristics.

Innovation Solution

A multilayer substrate design featuring a stacked body with coil conductor patterns, connection conductor patterns, and terminal conductors, where the coil and capacitor are configured in series, with terminal conductors positioned to minimize overlap and increase distance from conductor patterns, reducing unnecessary capacitance and enhancing LC parallel circuit accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the first lateral surface electrode and the second lateral surface electrode are used together with the coil conductor in proximity to generate capacitance, then the desired filter characteristics cannot be achieved due to unnecessary capacitance, but removing them limits the land conductor shape options for mounting

Engineering Contradiction:
Improvefilter characteristicsVSAvoidland conductor shape
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent extracts and removes the problematic coil conductor portions that are in proximity to the first and second lateral surface electrodes. By taking out these specific conductor segments that generate unnecessary capacitance, the invention eliminates the harmful electrical effect while preserving the mounting functionality through alternative conductor configurations.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent applies local quality by creating different functional zones within the conductor structure. The land conductor portions are designed with specific local characteristics to provide mounting functionality, while other portions are configured to avoid generating parasitic capacitance. This spatial differentiation of conductor properties resolves the contradiction between mounting adaptability and filter performance.

Inventive Principle:
Principle #3Local quality

2Device complexity

If the coil conductor is extended to provide both coil and capacitor functions, then the device complexity is reduced, but the mounting flexibility to external circuit boards is limited

Engineering Contradiction:
Improveconductor patternVSAvoidmounting
Core Design Contradiction:
Device complexityVSEase of operation

Solution Approach 1:

The patent segments the conductor pattern into distinct functional portions: land conductor portions for mounting purposes and coil conductor portions for inductance. This segmentation allows each portion to be optimized for its specific function, with land conductors providing mounting flexibility and coil conductors providing the desired inductance, thereby resolving the contradiction between simplicity and mounting ease.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design allows for easy mounting to external circuit boards and significantly reduces unnecessary capacitance, achieving desired filter characteristics and large capacitance with small inductance.

Implementation Method 1

a coil portion at which the first coil conductor pattern, the second coil conductor pattern, and the connection conductor pattern are disposed when viewed in the stacking direction of the plurality of insulating layers

Methodology Applied
Scientific EffectInductance: Inductor

Implementation Method 2

the first coil conductor pattern and the second coil conductor pattern extend in parallel or substantially in parallel with each other to provide a capacitor

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS11515069B2Multilayer substrate and electronic device
Publication Date: 2022.11.29 MURATA MFG CO LTD
  • US11515069B2 patent drawing
  • US11515069B2 patent drawing
  • US11515069B2 patent drawing

AI summary

A multilayer substrate includes a stacked body, coil conductor patterns, and a connection conductor pattern. The stacked body includes insulating layers. A first coil conductor pattern is provided on the front surface of an insulating layer and has a wound shape including outer and inner end portions. A second coil conductor pattern is provided on the front surface of the insulating layer and includes an end portion. The connection conductor pattern is provided in the stacked body, and connects the coil conductor patterns. The outer end portion is connected to a terminal conductor on a back surface of the stacked body. The end portion of the second coil conductor pattern is connected to the terminal conductor on the back surface of the stacked body. The first coil conductor pattern extends parallel or substantially parallel to the second coil conductor pattern along an outer periphery of the second coil conductor pattern.