Multilayer Substrate with Varying Conductor Thickness
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Solution Overview
Problem
Existing multilayer substrates face issues with conductor patterns short-circuiting due to uneven plated film thickness and resin flow during hot pressing, leading to thermal deformation and increased resistance.
Innovation Solution
A multilayer substrate design with varying conductor pattern thicknesses, where thicker patterns are closer to the outermost layers for improved heat transfer and thermal conductivity, and thinner patterns are strategically positioned to prevent short circuits, using a bonding layer with higher fluidity to manage resin flow during lamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If plated films are thickened to reduce resistance, then conductor pattern resistance decreases, but film thickness uniformity deteriorates and short circuit risk increases
Solution Approach 1:
The patent applies different plated film thicknesses to different conductor patterns based on their specific requirements. Outer layer conductor patterns have thicker plated films for lower resistance, while inner layer conductor patterns have thinner plated films for better uniformity control. This local differentiation resolves the contradiction by optimizing each conductor pattern's plated film thickness according to its position and functional needs.
2Productivity
If conductor patterns are arranged closer together to increase density, then integration density improves, but short circuit risk increases due to contact between patterns
Solution Approach 1:
The patent implements local quality differentiation by positioning thicker plated film conductor patterns on outer layers and thinner plated film conductor patterns on inner layers. This arrangement allows narrower pitch between outer layer patterns (higher density) while inner layer patterns maintain sufficient spacing and thinner profiles (lower short circuit risk). The layered thickness differentiation enables high integration density while preventing short circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the risk of short circuits, lowers resistance, and allows for thinner lamination thickness while maintaining high thermal conductivity and efficient mounting on circuit boards.
Implementation Method 1
the entirety of the lamination body is more quickly heated in hot pressing, and such a phenomenon that a layer located near the outermost layer is softened to flow earlier is prevented
Implementation Method 2
the resin substrates are more easily subjected to heat in hot pressing and the resin flows further as they are located closer to the outermost layers
Implementation Method 3
the growth rate (deposition rate) of the plated films vary depending on factors such as the convection state of a plating solution in a plating bath, the electrode interval in the case of electroplating
Data Source
AI summary
A multilayer substrate includes a lamination body including a first resin substrate, a second resin substrate, and a bonding layer that are hot-pressed. A first conductor pattern including a surface defined by a plated film is disposed on a first surface of the first resin substrate. A second conductor pattern including a surface defined by a plated film is disposed on a second surface of the first resin substrate. A third conductor pattern including a surface defined by a plated film is disposed on a third surface of the second resin substrate. A fourth conductor pattern including a surface defined by a plated film is disposed on a fourth surface of the second resin substrate. The first conductor pattern is located closer to one outermost layer than the second conductor pattern is. The second conductor pattern is thinner than the first conductor pattern.